×

Methods, apparatus, and systems for contacting semiconductor dies that are electrically coupled to test access interface positioned in scribe lines of a wafer

  • US 9,632,109 B2
  • Filed: 06/30/2011
  • Issued: 04/25/2017
  • Est. Priority Date: 06/30/2011
  • Status: Active Grant
First Claim
Patent Images

1. A device, comprising:

  • a first wafer having i) a first plurality of semiconductor dies, ii) a first plurality of scribe lines, each of the first plurality of scribe lines adjacent one or more of the first plurality of semiconductor dies, iii) a first test access interface positioned in one or more of the first plurality of scribe lines, the first test access interface having a first plurality of through-substrate conductors with a standardized physical layout, wherein the through-substrate conductors comprise a ground line and a signal line, and iv) electrical couplings between at least some of the first plurality of through-substrate conductors and at least one of the first plurality of semiconductor dies.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×