Light emitting diode and method of manufacturing the same

• US 9,634,193 B2
• Filed: 03/27/2015
• Issued: 04/25/2017
• Est. Priority Date: 09/16/2011
• Status: Active Grant

• Current Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Inventors: Chae, Jong Hyeon, Jang, Jong Min, Roh, Won Young, Suh, Daewoong, Cho, Dae Sung, Lee, Joon Sup, Lee, Kyu Ho, In, Chi Hyun
• Primary Examiner(s): Whalen, Daniel
• Assistant Examiner(s): Chi, Suberr
• Application Number:
  US14/671,491
• Publication Number:
  US 20150200334A1
• Time in Patent Office: 760 Days
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/14 with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting diode including a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer and having a conductivity type different than that of the first semiconductor layer, and a reflective pattern disposed on the second semiconductor layer and configured to reflect light emitted from the active layer, the reflective pattern having heterogeneous metal layers and configured to absorb stress caused by differences in coefficient of thermal expansion between the heterogeneous metal layers.

Claims

1. A light-emitting diode, comprising:

a substrate;

a first semiconductor layer disposed on the substrate;

an active layer disposed on the first semiconductor layer;

a second semiconductor layer disposed on the active layer and having a conductivity type different than that of the first semiconductor layer;

a reflective metal layer disposed on the second semiconductor layer;

a stress relief layer disposed directly on the reflective metal layer;

a conductive barrier layer disposed on the stress relief layer such that the conductive barrier layer directly contacts the second semiconductor layer and covers a side surface of the reflective metal layer and the stress relief layer;

a lower insulation layer disposed on the conductive barrier layer, and comprising a first opening that exposes a top portion of the conductive barrier layer and a second opening that exposes a portion of the first semiconductor layer; and

an upper insulation layer disposed on the lower insulation layer, and comprising a first opening that is wider than the first opening of the lower insulation layer and that exposes the top portion of the conductive barrier layer exposed by the first opening of the lower insulation layer,

wherein the stress relief layer is disposed between the reflective metal layer and the conductive barrier layer, and is configured to absorb stress caused by differences in the coefficient of thermal expansion of the reflective metal layer and the conductive barrier layer.

2. The light-emitting diode of claim 1, further comprising an antireflective layer disposed on the substrate, wherein the substrate comprises a pattern of depressions recessed from a surface of the substrate, and the antireflective layer is disposed between the pattern of depressions.

3. The light-emitting diode of claim 1, wherein the coefficient of thermal expansion of the stress relief layer is greater than or equal to that of the conductive barrier layer and is less than or equal to that of the reflective metal layer.

4. The light emitting diode of claim 1, wherein the reflective metal layer comprises at least one of Al and Ag.

5. The light-emitting diode of claim 1, wherein the conductive barrier layer comprises at least one of W, TiW, Mo, Ti, Cr, Pt, Rh, Pd, and Ni.

6. The light-emitting diode of claim 5, wherein the reflective metal layer comprises Al, the conductive barrier layer comprises at least one of W, TiW and Mo, and the stress relief layer comprises a single layer comprising at least one of Ag, Cu, Ni, Pt, Ti, Rh, Pd and Cr or a composite layer comprising at least one of Cu, Ni, Pt, Ti, Rh, Pd and Au.

7. The light-emitting diode of claim 5, wherein the reflective metal layer comprises Al, the conductive barrier layer comprises at least one of Ti, Cr, Pt, Rh, Pd and Ni, and the stress relief layer comprises a single layer comprising at least one of Ag and Cu or a composite layer comprising at least one of Ni, Au, Cu, and Ag.

8. The light-emitting diode of claim 5, wherein the reflective metal layer comprises Ag, the conductive barrier layer comprises at least one of W, TiW, and Mo, and the stress relief layer comprises a single layer comprising at least one of Cu, Ni, Pt, Ti, Rh, Pd, and Cr or a composite layer comprising at least one of Cu, Ni, Pt, Ti, Rh, Pd, Cr and Au.

9. The light-emitting diode of claim 5, wherein the reflective metal layer comprises Ag, the conductive barrier layer comprises at least one of Pt and Ni, and the stress relief layer comprises a single layer comprising at least one of Cu, Cr, Rh, Pd, TiW, and Ti or a composite layer comprising at least one of Ni, Au, and Cu.

10. The light-emitting diode of claim 1, wherein:

the light-emitting diode further comprises an ohmic bonding layer disposed between the reflective metal layer and the second semiconductor layer, and

the ohmic bonding layer comprises at least one of Ni, Pt, ITO, and ZnO.

11. The light-emitting diode of claim 1, wherein a lateral profile of the active layer and the second semiconductor layer has an inclination of 20 to 70 degrees with respect to a surface of the first semiconductor layer.

12. The light-emitting diode of claim 1, further comprising a current spreading layer disposed on the lower insulation layer and disposed on the portion of the first semiconductor through the second opening of the lower insulation layer.

13. The light-emitting diode of claim 12, wherein the active layer and the second semiconductor layer form a mesa and the lower insulation layer is disposed on a side wall of the mesa.

14. A method of fabricating a light emitting diode, the method comprising:

sequentially forming a first semiconductor layer, an active layer, and a second semiconductor layer on a substrate;

forming a mesa area by etching the second semiconductor layer and the active layer such that a surface of the first semiconductor layer is exposed through the mesa area; and

forming a photoresist pattern on the mesa area;

forming a reflective metal layer on the second semiconductor layer through a space opened by the photoresist pattern such that the reflective metal layer is configured to reflect light emitted from the active layer;

forming a stress relief layer directly on the reflective metal layer;

forming a conductive barrier layer to directly contact the second semiconductor layer;

forming a lower insulation layer on the conductive barrier layer and the first semiconductor layer such that the lower insulation layer comprises a first opening exposing a top portion of the conductive barrier layer and a second opening exposing the first semiconductor layer;

forming an upper insulation layer disposed on the lower insulation layer such that the upper insulation comprises a first opening that is wider than the first opening of the lower insulation layer and that exposes the top portion of the conductive barrier layer exposed by the first opening of the lower insulation layer; and

removing the photoresist pattern.

15. The method of claim 14, wherein the photoresist pattern comprises an overhang structure and an upper portion of the overhang structure has a greater width than a lower portion of the overhang structure.

16. The method of claim 14, wherein the reflective metal layer and the stress relief layer are formed by anisotropic deposition and the conductive barrier layer is formed by isotropic deposition.

17. The method of claim 14, wherein the mesa area is a stripe type or hole type.

18. The method of claim 14, wherein forming the mesa area further comprises forming a side wall of the mesa by etching the second semiconductor layer and the active layer.

19. The method of claim 18, wherein forming the lower insulation layer further comprises forming the lower insulation layer on the side wall of the mesa.

20. The method of claim 19, further comprising:

forming a current spreading layer disposed on the lower insulation layer and the first semiconductor through the second opening of the lower insulation layer, wherein forming the upper insulation layer further comprises forming the upper insulation layer on the current spreading layer.