Semiconductor component and method of producing a semiconductor component

• US 9,634,207 B2
• Filed: 05/05/2016
• Issued: 04/25/2017
• Est. Priority Date: 06/22/2010
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Kruppa, Michael, Jerebic, Simon
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US15/146,984
• Publication Number:
  US 20160247986A1
• Time in Patent Office: 355 Days
• Field of Search: None
• CPC Class Codes: B29D 11/00442 Curing the lens material
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 75/00 Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: G02B 1/04 made of organic materials, e.g. plastics G02B1/08 takes precedence
• CPC Class Codes: G02B 27/095 Refractive optical elements
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.

Claims

1. A method of producing a semiconductor component comprising:

a) providing an optoelectronic semiconductor chip;

b) applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material;

c) precuring the molding compound at a temperature of at most 50°

C.; and

d) curing the molding compound.

2. The method according to claim 1, wherein the precuring is induced by electromagnetic radiation.

3. The method according to claim 2, wherein the molding compound is exposed to radiation with an energy input of 0.2 J/cm² to 2.0 J/cm² in step c).

4. The method according to claim 1, wherein the molding compound is activated by mixing at least two components of the molding compound in step c).

5. The method according to claim 1, wherein step d) is carried out at a higher temperature than step c).

6. The method according to claim 1, wherein thermal curing is carried out in step d).