Display panel and manufacturing method of the same
First Claim
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1. A manufacturing method of a display panel, the method comprising:
- forming a non-emission region layer having a plurality of emission regions and a connection region that is open to connect adjacent emission regions;
forming an encapsulation layer on the non-emission region layer where the plurality of emission regions and the connection region are not formed, the encapsulation layer formed in a region that is not a pixel area of a display portion;
forming an organic emission layer in each of the emission regions;
forming a counter electrode in the emission regions and the connection region; and
melting the encapsulation layer to cover and seal the counter electrode,wherein melting the encapsulation comprises tilting the non-emission region layer, the encapsulation layer, the organic emission layer by a certain angle with respect to a ground surface while melting the encapsulation layer to cover and seal the counter electrode, andwherein the encapsulation layer directly contacts the counter electrode after melting the encapsulation layer to cover and seal the counter electrode.
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Abstract
In one aspect, a display panel and a manufacturing method of the same is provided. The display panel includes a non-emission region layer having a plurality of emission regions and a connection region that is open to connect adjacent emission regions; an organic emission layer formed in each of the plurality of emission regions; a counter electrode formed in the emission regions and the connection region; and an encapsulation layer formed on the counter electrode.
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Citations
11 Claims
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1. A manufacturing method of a display panel, the method comprising:
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forming a non-emission region layer having a plurality of emission regions and a connection region that is open to connect adjacent emission regions; forming an encapsulation layer on the non-emission region layer where the plurality of emission regions and the connection region are not formed, the encapsulation layer formed in a region that is not a pixel area of a display portion; forming an organic emission layer in each of the emission regions; forming a counter electrode in the emission regions and the connection region; and melting the encapsulation layer to cover and seal the counter electrode, wherein melting the encapsulation comprises tilting the non-emission region layer, the encapsulation layer, the organic emission layer by a certain angle with respect to a ground surface while melting the encapsulation layer to cover and seal the counter electrode, and wherein the encapsulation layer directly contacts the counter electrode after melting the encapsulation layer to cover and seal the counter electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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