Chip level sensor with multiple degrees of freedom
First Claim
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1. A sensing assembly device comprising:
- a substrate;
a chamber above the substrate;
a first piezoelectric gyroscope sensor positioned within the chamber; and
a first accelerometer positioned within the chamber, wherein the chamber is pressurized to a pressure sufficient to provide damping for the first accelerometer;
the first piezoelectric gyroscope comprises;
a first and second support beam, each of the first and second support beams having a respective pair of piezoelectric drive elements;
a first and second secondary support beams supported by the first support beam;
a third and a fourth secondary support beam supported by the second support beam;
a seismic mass supported by the first, second, third, and fourth secondary support beams; and
four piezoelectric sense elements, each of the four piezoelectric sense elements located on a respective one of the first, second, third, and fourth secondary support beams.
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Abstract
A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
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Citations
18 Claims
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1. A sensing assembly device comprising:
- a substrate;
a chamber above the substrate;
a first piezoelectric gyroscope sensor positioned within the chamber; and
a first accelerometer positioned within the chamber, wherein the chamber is pressurized to a pressure sufficient to provide damping for the first accelerometer;
the first piezoelectric gyroscope comprises;
a first and second support beam, each of the first and second support beams having a respective pair of piezoelectric drive elements;
a first and second secondary support beams supported by the first support beam;
a third and a fourth secondary support beam supported by the second support beam;
a seismic mass supported by the first, second, third, and fourth secondary support beams; and
four piezoelectric sense elements, each of the four piezoelectric sense elements located on a respective one of the first, second, third, and fourth secondary support beams. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- a substrate;
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13. A method of forming a sensing assembly device comprising:
- providing a substrate;
forming a first piezoelectric gyroscope sensor above the substrate;
forming a first accelerometer positioned above the substrate; and
forming a chamber above the substrate such that the first piezoelectric gyroscope sensor and the first accelerometer are within the chamber;
wherein forming the first piezoelectric gyroscope sensor comprises;
forming a first and a second support beam;
forming a first pair of piezoelectric drive elements on the first support beam;
forming a second pair of piezoelectric drive elements on the second support beam;
supporting a first and a second secondary support beam with the first support beam;
supporting a third and a fourth secondary support beam with the second support beam;
supporting a seismic mass with the first, second, third, and fourth secondary support beams;
positioning a first piezoelectric sense element on the first secondary support beam;
positioning a second piezoelectric sense element on the second secondary support beam;
positioning a third piezoelectric sense element on the third secondary support beam; and
positioning a fourth piezoelectric sense element on the fourth secondary support beam. - View Dependent Claims (14, 15, 16, 17, 18)
- providing a substrate;
Specification