Heat dissipation structure of wearable electronic device
First Claim
1. A heat dissipation structure of wearable electronic device comprising:
- a wearable main body including a receiving space, a circuit board and multiple electronic components, the electronic components being arranged on the circuit board, the circuit board with the electronic components being received in the receiving space, at least one of the electronic components being a heat source; and
a wearable strap body connected with the wearable main body, the wearable strap body having a heat conduction section and a protection section, the protection section enclosing the heat conduction section, a section of the heat conduction section being exposed to an interior of the receiving space without being enclosed by the protection section;
wherein the heat conduction section has a first heat conduction layer, a second heat conduction layer and a third heat conduction layer, the whole second heat conduction layer being sandwiched between the first and third heat conduction layers, an outer face of the first heat conduction layer of the exposed section of the heat conduction section in the receiving space being attached to the heat source; and
wherein the first and third heat conduction layers are made of metal foils and the second heat conduction layer is made of graphite material, the protection section being made of flexible plastic material.
1 Assignment
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Accused Products
Abstract
A heat dissipation structure of wearable electronic device includes a wearable main body and a wearable strap body connected with the wearable main body. The wearable main body includes a receiving space, a circuit board and multiple electronic components arranged on the circuit board. At least one of the electronic components is a heat source. The wearable strap body has a heat conduction section and a protection section enclosing the heat conduction section. A section of the heat conduction section is exposed to an interior of the receiving space without being enclosed by the protection section. The exposed section of the heat conduction section is in contact with the corresponding heat source on the circuit board so as to greatly enhance the heat dissipation performance of the wearable electronic device.
15 Citations
16 Claims
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1. A heat dissipation structure of wearable electronic device comprising:
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a wearable main body including a receiving space, a circuit board and multiple electronic components, the electronic components being arranged on the circuit board, the circuit board with the electronic components being received in the receiving space, at least one of the electronic components being a heat source; and a wearable strap body connected with the wearable main body, the wearable strap body having a heat conduction section and a protection section, the protection section enclosing the heat conduction section, a section of the heat conduction section being exposed to an interior of the receiving space without being enclosed by the protection section; wherein the heat conduction section has a first heat conduction layer, a second heat conduction layer and a third heat conduction layer, the whole second heat conduction layer being sandwiched between the first and third heat conduction layers, an outer face of the first heat conduction layer of the exposed section of the heat conduction section in the receiving space being attached to the heat source; and wherein the first and third heat conduction layers are made of metal foils and the second heat conduction layer is made of graphite material, the protection section being made of flexible plastic material. - View Dependent Claims (2, 3)
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4. A heat dissipation structure of wearable electronic device comprising:
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a wearable main body including a receiving space, a circuit board and multiple electronic components, the electronic components being arranged on the circuit board, the circuit board with the electronic components being received in the receiving space, at least one of the electronic components being a heat source; a wearable strap body connected with the wearable main body, the wearable strap body having a heat conduction section and a protection section, the protection section enclosing the heat conduction section, a section of the heat conduction section being exposed to an interior of the receiving space without being enclosed by the protection section; and wherein the heat conduction section is a heat pipe made of flexible metal material, the heat conduction section having a chamber and a capillary structure, a working fluid being filled in the chamber, the capillary structure being formed on inner wall face of the chamber, one face of the exposed section of the heat conduction section in the receiving space being attached to the heat source, the protection section being made of flexible plastic material or hard plastic material. - View Dependent Claims (5)
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6. A heat dissipation structure of wearable electronic device comprising:
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a wearable main body including a receiving space, a circuit board and multiple electronic components, the electronic components being arranged on the circuit board, the circuit board with the electronic components being received in the receiving space, at least one of the electronic components being a heat source; a wearable strap body connected with the wearable main body, the wearable strap body having a heat conduction section and a protection section, the protection section enclosing the heat conduction section, a section of the heat conduction section being exposed to an interior of the receiving space without being enclosed by the protection section; and wherein the heat conduction section is a heat pipe made of hard metal material, the heat conduction section having a chamber and a capillary structure, a working fluid being filled in the chamber, the capillary structure being formed on inner wall face of the chamber, one face of the exposed section of the heat conduction section in the receiving space being attached to the heat source, the protection section being made of hard plastic material. - View Dependent Claims (7)
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8. A heat dissipation structure of wearable electronic device comprising:
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a wearable main body including a receiving space, a circuit board and multiple electronic components, the electronic components being arranged on the circuit board, the circuit board with the electronic components being received in the receiving space, at least one of the electronic components being a heat source; a wearable strap body connected with the wearable main body, the wearable strap body having a heat conduction section and a protection section, the protection section enclosing the heat conduction section, a section of the heat conduction section being exposed to an interior of the receiving space without being enclosed by the protection section, the exposed section of the heat conduction section being indirectly in contact with the corresponding heat source; wherein the heat conduction section has a first heat conduction body and a second heat conduction body and the protection section has a first protection body and a second protection body, the first and second protection bodies respectively enclosing the first and second heat conduction bodies, a section of the first and second heat conduction bodies being exposed to an interior of the receiving space without being enclosed by the first and second protection bodies, the exposed sections of the first and second heat conduction bodies being opposite to each other, the battery in the receiving space being positioned under the exposed sections of the first and second heat conduction bodies; and wherein the wearable main body further includes a conduction section received in the receiving space and positioned on upper side of the first and second heat conduction bodies, two opposite sides of one face of the conduction section respectively contacting one face of the corresponding exposed sections of the first and second heat conduction bodies, the other face of the conduction section being attached to the heat source on the circuit board. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A heat dissipation structure of wearable electronic device comprising:
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a wearable main body including a receiving space, a circuit board and multiple electronic components, the electronic components being arranged on the circuit board, the circuit board with the electronic components being received in the receiving space, at least one of the electronic components being a heat source; a wearable strap body connected with the wearable main body, the wearable strap body having a heat conduction section and a protection section, the protection section enclosing the heat conduction section, a section of the heat conduction section being exposed to an interior of the receiving space without being enclosed by the protection section; wherein the heat conduction section has a first heat conduction body and a second heat conduction body and the protection section has a first protection body and a second protection body, each of the first and second heat conduction bodies having a first heat conduction layer, a second heat conduction layer and a third heat conduction layer, the second heat conduction layer of the first heat conduction body being sandwiched between the first and third heat conduction layers of the first conduction body, the second heat conduction layer of the second heat conduction body being sandwiched between the first and third heat conduction layers of the second heat conduction body, the first and second protection bodies respectively enclosing the first and second heat conduction bodies, a section of the first and second heat conduction bodies being exposed to an interior of the receiving space without being enclosed by the first and second protection bodies, one face of the first heat conduction layer of the exposed sections of the first and second heat conduction bodies being attached to the heat source; and wherein the first and third heat conduction layers of the first and second heat conduction bodies are made of metal foils and the second heat conduction layers of the first and second heat conduction bodies are made of graphite material, the first and second protection bodies being made of flexible plastic material. - View Dependent Claims (16)
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Specification