Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor

• US 9,639,189 B2
• Filed: 06/08/2015
• Issued: 05/02/2017
• Est. Priority Date: 10/03/2011
• Status: Active Grant

• Current Assignee: Resonac Corp. (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Yamazaki, Hiroshi, Igarashi, Yoshimi
• Primary Examiner(s): Pert, Evan
• Application Number:
  US14/732,817
• Publication Number:
  US 20150271919A1
• Time in Patent Office: 694 Days
• CPC Class Codes: G03F 7/0005 Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/09 characterised by structural details, e.g. supports, auxiliary layers supports for printing plates in general B41N
• CPC Class Codes: G03F 7/092 characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
• CPC Class Codes: G03F 7/095 having more than one photosensitive layer G03F7/075 takes precedence
• CPC Class Codes: G03F 7/0952 comprising silver halide or silver salt based image forming systems, e.g. for camera speed exposure
• CPC Class Codes: G03F 7/0955 one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
• CPC Class Codes: G03F 7/2022 Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0275 Fibers and reinforcement materials
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Claims

1. A conductive film substrate comprising:

a. a substrate; and

b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first surface having a portion including a conductive film and a portion without a conductive film, wherein the portion of the cured resin layer including the conductive film comprises a cured portion projecting from the cured resin layer, the cured portion projecting the from the cured resin layer abutting the conductive film.

2. The conductive film substrate according to claim 1, wherein a step difference Ha between the portion including the conductive film and the portion without the conductive film is 1 μ

m or less.

3. The conductive film substrate according to claim 1, wherein a step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.7 μ

m or less.

4. The conductive film substrate according to claim 1, wherein a step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.5 μ

m or less.

5. The conductive film substrate according to claim 1, wherein the conductive film comprises an organic conductive material.

6. The conductive film substrate according to claim 1, wherein the conductive film comprises conductive fiber.

7. The conductive film substrate according to claim 1, wherein the conductive film comprises silver fiber.

8. The conductive film substrate according to claim 1, wherein a minimum optical transmittance of the conductive film substrate in a wavelength band of 450 to 650 nm is 80% or higher.

9. A conductive film substrate comprising:

a. a photosensitive resin layer comprising;

i. a photopolymerization initiator the activity of which is decreased by oxygen;

ii. a first surface; and

iii. a second surface opposite the first surface; and

b. a conductive film comprising;

i. a first surface; and

ii. a second surface opposite the first surface, the second surface abutting the first surface of the photosensitive resin layer.

10. The conductive film substrate according to claim 9, further comprising a support film on the first surface of the conductive film.

11. The conductive film substrate according to claim 10, wherein the support film includes a gas barrier layer.

12. The conductive film substrate according to claim 9, further comprising a protective film on the second surface of the photosensitive resin layer.

13. The conductive film substrate according to claim 9, further comprising a substrate abutting the second surface of the photosensitive resin layer.

14. The conductive film substrate according to claim 9, wherein the conductive film includes metal fiber.

15. The conductive film substrate according to claim 9, wherein the conductive film includes a conductive polymer.

16. The conductive film substrate according to claim 9, wherein the photosensitive resin layer comprises:

a. a portion cured in a first exposure;

b. a portion cured in a second exposure; and

c. lacks a boundary between the portion cured in the first exposure and the portion cured in the second exposure.

17. The conductive film substrate according to claim 9, wherein the first surface of the photosensitive resin layer abutting the second surface of the conductive film comprises:

a. a cured region; and

b. an insufficiently cured region.

18. The conductive film substrate according to claim 17, wherein the photosensitive resin layer further comprises a resin cured layer abutting the insufficiently cured region and opposite the conductive film.