System and method for detecting a process point in multi-mode pulse processes
First Claim
1. A method comprising:
- applying a multi-mode pulsing process to a selected wafer in a plasma process chamber, the multi-mode pulsing process including a plurality of cycles, each one of the plurality of cycles including a plurality of different phases;
collecting at least one process output variable for a phase of the plurality of phases during the plurality of cycles for the selected wafer;
comparing a plurality of trajectories of the at least one process output variable for the phase across the plurality of cycles;
calculating a distance from a point on a first one of the trajectories for a first one of the cycles to a point on a second one of the trajectories for a second one of the cycles; and
determining based on the distance whether an endpoint of the multi-mode pulsing process is reached.
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Abstract
A system and method of identifying a selected process point in a multi-mode pulsing process includes applying a multi-mode pulsing process to a selected wafer in a plasma process chamber, the multi-mode pulsing process including multiple cycles, each one of the cycles including at least one of multiple, different phases. At least one process output variable is collected for a selected at least one of the phases, during multiple cycles for the selected wafer. An envelope and/or a template of the collected at least one process output variable can be used to identify the selected process point. A first trajectory for the collected process output variable of a previous phase can be compared to a second trajectory of the process output variable of the selected phase. A multivariate analysis statistic of the second trajectory can be calculated and used to identify the selected process point.
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Citations
17 Claims
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1. A method comprising:
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applying a multi-mode pulsing process to a selected wafer in a plasma process chamber, the multi-mode pulsing process including a plurality of cycles, each one of the plurality of cycles including a plurality of different phases; collecting at least one process output variable for a phase of the plurality of phases during the plurality of cycles for the selected wafer; comparing a plurality of trajectories of the at least one process output variable for the phase across the plurality of cycles; calculating a distance from a point on a first one of the trajectories for a first one of the cycles to a point on a second one of the trajectories for a second one of the cycles; and determining based on the distance whether an endpoint of the multi-mode pulsing process is reached. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification