Single-and dual-chamber module-attachable wafer-handling chamber

• US 9,640,416 B2
• Filed: 12/26/2012
• Issued: 05/02/2017
• Est. Priority Date: 12/26/2012
• Status: Active Grant

• Current Assignee: ASM IP Holding B.V. (ASM International NV)
• Original Assignee: ASM IP Holding B.V. (ASM International NV)
• Inventors: Arai, Izumi
• Primary Examiner(s): Hassanzadeh, Parviz
• Assistant Examiner(s): Ford, Nathan K
• Application Number:
  US13/727,324
• Publication Number:
  US 20140174354A1
• Time in Patent Office: 1,588 Days
• Field of Search: 118719, 15634532
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: Y10S 901/30 End effector

Abstract

A single- and dual-chamber module-attachable wafer-handling chamber includes: a wafer-handling main chamber equipped with a wafer-handling robot therein, and adaptors for connecting process modules to the wafer-handling main chamber. The adaptors are detachably attached to the sides of the wafer-handling main chamber, respectively, and the process modules are detachably attached to the adaptors, respectively, so that the process modules can be attached to the wafer-handling main chamber, regardless of whether the process modules are of a single-chamber type or dual-chamber type.

Claims

1. A single- and dual-chamber module-attachable wafer-handling chamber, comprising:

a wafer-handling main chamber having a polygonal shape having multiple sides for connecting process modules thereto, respectively, and one additional side for a load lock chamber, wherein at least one process module has a single reaction chamber, and each of the multiple sides is flat and has a single opening for communicating with the process module connected thereto, whereby the single opening has a width sufficient to accommodate a process module having two reaction chambers;

a wafer-handling robot installed inside the wafer-handling main chamber for transferring wafers between chambers connected to the wafer-handling main chamber, said wafer-handling robot being accessible to each of the chambers connected to the wafer-handling main chamber; and

adaptors for connecting the respective process modules to the wafer-handling main chamber, each adaptor having an inner face and an outer face and being a single component which is interposed between one of the multiple sides of the main chamber and a process module to be attached to the one of the multiple sides via the adaptor, each adaptor being interchangeably attachable to any one of the multiple sides,

wherein the inner faces are attached to the multiple sides of the wafer-handling main chamber, respectively, and are adapted to be detachable from the respective multiple sides,

the inner face of each adaptor being flat and enclosing entirely the single opening of each of the multiple sides, and

the outer faces are adapted to detachably attach the process modules thereto, respectively, and the outer face of each adaptor adapted to attach thereto a process module having a single reaction chamber has a single opening, and the outer face of each adaptor adapted to attach thereto a process module having two reaction chambers has two openings and is flat;

the outer face of at least one adaptor adapted to attach thereto a process module having a single reaction chamber is inclined with respect to the inner face of the at least one adaptor, for attaching the process module thereto at an angle other than a right angle defined by an axis extending perpendicular to the inner face of the adaptor as viewed from above, so that the angle at which the process module is attached to the main chamber can be changed for any one of the multiple sides of the main chamber by installing the adaptor having the inclined outer face instead of installing an adaptor having a non-inclined flat outer face,

wherein the inner face and the outer face of each adaptor have aligning structures for aligning the adaptor with the corresponding side of the multiple sides and with the process module, respectively, so that wafers can be transferred using the wafer-handling robot between the wafer-handling main chamber and the process modules through the openings of the adaptors and the openings of the multiple sides of the wafer-handling main chamber when the process modules are connected to the multiple sides of the wafer-handling main chamber, respectively, via the respective adaptors.

2. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the single opening of each adaptor adapted to attach a process module having a single reaction chamber is disposed in a center of each adaptor.

3. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the single opening of each adaptor adapted to attach a process module having a single reaction chamber is disposed aside from a center of the each adaptor.

4. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein said at least one adaptor does not constitute all of the adaptors, and at least one adaptor other than said at least one adaptor has a uniform thickness from one end of the adaptor to another end of the adaptor as viewed from above.

5. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein an angle defined by an axis of the process module attached to one of the multiple sides of the wafer-handling main chamber and an axis of the process module attached to another of the multiple sides of the wafer-handling main chamber next to the one of the multiple sides of the wafer-handling main chamber as viewed from above, is smaller than an angle defined by a line perpendicular to the one of the multiple sides of the wafer-handling main chamber and a line perpendicular to the another of the multiple sides of the wafer-handling main chamber as viewed from above, said axis of each process module extending perpendicular to the outer face of the adaptor to which the process module is attached as viewed from above.

6. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the wafer-handling robot has a half-U-shaped top arm connected to an end effector.

7. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the wafer-handling robot is a double-arm robot.

8. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein each adaptor is provided with a gate valve on the inner surface for closing and opening the opening of the adaptor.

9. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein each adaptor has an average thickness of about 50 mm to about 100 mm.

10. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the adaptors are made of an aluminum alloy, and the process modules are not connectable to the wafer-handling main chamber without the adaptors.

11. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein each adaptor is provided with no gate valve for closing and opening the opening of the adaptor.