Method for manufacturing display element, display element, and display device

• US 9,640,718 B2
• Filed: 02/04/2014
• Issued: 05/02/2017
• Est. Priority Date: 03/04/2013
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Miura, Kentaro, Sakano, Tatsunori, Ueda, Tomomasa, Saito, Nobuyoshi, Nakano, Shintaro, Maeda, Yuya, Yamaguchi, Hajime
• Primary Examiner(s): Jackson, Jr., Jerome
• Assistant Examiner(s): Lin, John
• Application Number:
  US14/171,947
• Publication Number:
  US 20140246685A1
• Time in Patent Office: 1,183 Days
• Field of Search: 438 22, 438 33, 438 34
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: H10K 71/851 Division of substrate

Abstract

According to one embodiment, a method for manufacturing a display element is disclosed. The method can include forming a peeling layer, forming a resin layer, forming a barrier layer, forming an interconnect layer, forming a display layer, and removing. The peeling layer is formed on a major surface of a base body. The major surface has first, second, and third regions. The peeling layer includes first, second, and third peeling portions. The resin layer is formed on the peeling layer. The resin layer includes first and second resin portions. The barrier layer is formed on the first, second, and third peeling portions. The interconnect layer is formed on the barrier layer. The display layer is formed on the interconnect layer. The first peeling portion is removed from the first resin portion and the second peeling portion is removed from the second resin portion.

Claims

1. A method for manufacturing a display element, comprising:

forming a peeling layer having a first linear coefficient of thermal expansion on a major surface of a base body, the major surface having a first region, a second region provided around the first region, and a third region provided between the first region and the second region, the first region corresponding to a display region of the display element, the peeling layer including a first peeling portion positioned on the first region, a second peeling portion positioned on the second region, and a third peeling portion positioned on the third region;

forming a resin layer having a first water permeability and a second linear coefficient of thermal expansion different from the first linear coefficient of thermal expansion on the peeling layer, the resin layer including a first resin portion positioned on the first peeling portion and a second resin portion positioned on the second peeling portion;

forming a barrier layer having a second water permeability lower than the first water permeability on the first resin portion, the second resin portion, and the third peeling portion;

forming an interconnect layer on the barrier layer;

forming a display layer on at least a portion of the interconnect layer on the first resin portion; and

removing the first peeling portion from the first resin portion and removing the second peeling portion from the second resin portion,

wherein

the forming of the resin layer includes forming a resin film on the first region, on the second region, and on the third region and removing the resin film on the third region, and

the barrier layer contacts the third peeling portion.

2. The method according to claim 1, wherein

the major surface has the first region in a plurality, and

the method further comprises dividing the second resin portion, the barrier layer, and the interconnect layer by making a trench in the second resin portion, the barrier layer, and the interconnect layer in the second region between the plurality of first regions along a stacking direction from the base body toward the display layer between the forming of the display layer and the removing.

3. The method according to claim 2, wherein the dividing includes making the trench by irradiating a first light onto the second resin portion, the barrier layer, and the interconnect layer.

4. The method according to claim 3, wherein

the dividing includes making the trench by irradiating a first light onto the second resin portion, the barrier layer, and the interconnect layer,

the removing of the peeling layer includes irradiating a second light through the base body onto the peeling layer,

the first light is light emitted from one selected from a picosecond laser, a femtosecond laser, and an ultraviolet laser, and

the second light is light emitted from one selected from a YAG laser, an infrared laser, and a lamp.

5. The method according to claim 1, wherein the removing of the peeling layer includes irradiating a second light through the base body onto the peeling layer.

6. The method according to claim 1, wherein the peeling layer includes at least one selected from a metal, a metal oxide, and a metal nitride.

7. The method according to claim 1, further comprising exposing a portion of the interconnect layer by removing a portion of the barrier layer exposed by the removing of the first peeling portion and the second peeling portion.

8. The method according to claim 1, wherein

the interconnect layer includes a first electrode provided on the first region, and

the display layer includes a second electrode and an organic light emitting layer provided between the first electrode and the second electrode.

9. The method according to claim 1, wherein the resin layer includes at least one selected from a polyimide resin, acrylic, aramid, epoxy, a cyclic polyolefin, or a liquid crystal polymer, a paraxylene resin, a fluoric resin, polyethersulphone, polyethylene naphthalate, and polyetheretherketone.

10. The method according to claim 1, wherein an oxygen permeability of the barrier layer is lower than an oxygen permeability of the resin layer.

11. The method according to claim 1, wherein the barrier layer includes at least one selected from a silicon nitride film, a silicon oxynitride film, a silicon oxide film and an aluminum oxide film.

12. The method according to claim 1, wherein the barrier layer includes a stacked film of an inorganic film and an organic resin film.

13. The method according to claim 1, wherein the resin layer includes a film of a metal of one selected from Ti, Mo, Ta, Al, W and Cu, and a film of an alloy including the metal.

14. The method according to claim 1, wherein a thickness of the resin layer is not less than 1 micrometer and not more than 30 micrometers.

15. The method according to claim 1, wherein a distance between the first resin portion and the second resin portion when projected onto a plane perpendicular to a stacking direction from the base body toward the display layer is not less than 1 micrometer and not more than 100 micrometers.