Industrial process field device with humidity-sealed electronics module

• US 9,642,273 B2
• Filed: 09/25/2013
• Issued: 05/02/2017
• Est. Priority Date: 09/25/2013
• Status: Active Grant

• Current Assignee: Rosemount Incorporated (Emerson Electric Company)
• Original Assignee: Rosemount Incorporated (Emerson Electric Company)
• Inventors: Norman, Kirsten Nicole, Perrault, Aaron Andrew, Rud, Jason Harold, Holmstadt, Clarence Edward
• Primary Examiner(s): Laballe, Clayton E
• Assistant Examiner(s): Hancock, Dennis
• Application Number:
  US14/036,787
• Publication Number:
  US 20150085449A1
• Time in Patent Office: 1,315 Days
• Field of Search: 73431
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: H05K 5/069 Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
• CPC Class Codes: H05K 7/1462 for programmable logic controllers [PLC] for automation or industrial process control

Abstract

A field device for use in an industrial process includes a housing having a cavity formed therein. A humidity-sealed electronics module has a first compartment formed therein and is positioned in the cavity. The humidity-sealed electronics module includes a seal board. The seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing. A first electrical component in the first compartment is mounted to the seal board and a second electrical component in the second compartment is electrically connected to the first electrical component.

Claims

1. A field device for use in an industrial process, comprising:

a housing having a cavity formed therein;

a humidity-sealed electronics module having a first compartment formed therein, the humidity-sealed electronics module positioned in the cavity and including a seal board, wherein the seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing and forms a seal therebetween;

a first electrical component in the first compartment mounted to the seal board; and

a second electrical component in the second compartment electrically connected to the first electrical component;

wherein the humidity-sealed electronics module divides the housing into the second compartment and a third compartment and the first compartment is sealed with respect to the second and third compartments and the second compartment is further sealed with respect to the third compartment;

wherein the humidity-sealed electronics module includes a side wall and the seal board is sealed to the sidewall; and

wherein the humidity-sealed electronics module includes a second seal board sealed to the side wall opposite the seal board.

2. The field device of claim 1, wherein the humidity-sealed electronics module includes the second seal board which carries a third electrical component.

3. The field device of claim 1, wherein the side wall comprises metal.

4. The field device of claim 3, wherein the metal comprises an aluminum alloy.

5. The field device of claim 1, wherein the seal board comprises a multi-layer printed circuit board.

6. The field device of claim 1, wherein the seal board includes at least two metal layers.

7. The field device of claim 1, wherein the at least two metal layers comprise copper.

8. The field device of claim 1, wherein the first electrical component comprises process variable measurement circuitry.

9. The field device of claim 1, wherein the first electrical component comprises a communication circuitry.

10. The field device of claim 1, wherein the second electrical component comprises communication circuitry.

11. The field device of claim 1, wherein the humidity-sealed electronics module includes a flange which amounts to a wall of the housing.

12. The field device of claim 1, wherein the third compartment includes a process control loop connection.

13. The field device of claim 1, wherein the third compartment includes a process variable sensor connection.

14. The field device of claim 1, wherein the seal board is soldered to the side wall.

15. The field device of claim 1, wherein the second compartment is sealed in accordance with intrinsic safety standards.

16. The field device of claim 1, wherein the humidity-sealed electronics module is cylindrical.

17. The field device of claim 1 including an electrical via which electrically couples to the first electrical component and extends through the seal board.