Welding and soldering of transistor leads
First Claim
1. A method of manufacturing an electronic device, the method comprising:
- positioning a transistor having respective input, output and control leads extending parallel to each other, the control lead longer than the input and output leads;
placing at least first and second busbar layers relative to the transistor so that each of the input, output and control leads extend through a first opening in the first busbar layer and through a second opening in the second busbar layer, the first and second busbar layers placed so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads;
welding the first tab and the one of the input and output leads to each other, and the second tab and the other one of the input and output leads to each other;
placing a circuit board parallel to the first and second busbar layers so that the control lead and at least one of the first and second tabs extend through corresponding openings in the circuit board; and
soldering the control lead and the at least one of the first and second tabs to one or more circuits on the circuit board.
2 Assignments
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Accused Products
Abstract
In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.
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Citations
14 Claims
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1. A method of manufacturing an electronic device, the method comprising:
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positioning a transistor having respective input, output and control leads extending parallel to each other, the control lead longer than the input and output leads; placing at least first and second busbar layers relative to the transistor so that each of the input, output and control leads extend through a first opening in the first busbar layer and through a second opening in the second busbar layer, the first and second busbar layers placed so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; welding the first tab and the one of the input and output leads to each other, and the second tab and the other one of the input and output leads to each other; placing a circuit board parallel to the first and second busbar layers so that the control lead and at least one of the first and second tabs extend through corresponding openings in the circuit board; and soldering the control lead and the at least one of the first and second tabs to one or more circuits on the circuit board. - View Dependent Claims (2, 3, 4, 5)
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6. An electronic device comprising:
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a transistor having respective input, output and control leads extending parallel to each other, the control lead longer than the input and output leads; at least first and second busbar layers placed relative to the transistor so that each of the input, output and control leads extend through a first opening in the first busbar layer and through a second opening in the second busbar layer, the first and second busbar layers placed so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; a circuit board placed parallel to the first and second busbar layers so that the control lead and at least one of the first and second tabs extend through corresponding openings in the circuit board; wherein the first tab and the one of the input and output leads are connected to each other by a first weld joint, and the second tab and the other one of the input and output leads are connected to each other by a second weld joint; and wherein the control lead and the at least one of the first and second tabs are connected to one or more circuits on the circuit board by solder joints. - View Dependent Claims (7, 8)
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9. An electronic device comprising:
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a transistor having respective input, output and control leads extending parallel to each other, the control lead longer than the input and output leads; at least first and second busbar layers placed relative to the transistor so that each of the input, output and control leads extend through a first opening in the first busbar layer and through a second opening in the second busbar layer, the first busbar layer having first means for forming a first weld joint between one of the input and output leads and the first busbar layer, the second busbar layer having second means for forming a second weld joint between another one of the input and output leads and the second busbar layer; and a circuit board placed parallel to the first and second busbar layers so that the control lead and at least one of the first and second means extend through corresponding openings in the circuit board, wherein the control lead and the at least one of the first and second means are connected to one or more circuits on the circuit board by solder joints. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification