Flexible embedded sensor arrays and methods of making the same

• US 9,642,566 B2
• Filed: 10/04/2013
• Issued: 05/09/2017
• Est. Priority Date: 10/04/2013
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Kapusta, Christopher James, Davis, Eric Patrick, Karp, Jason Harris
• Primary Examiner(s): Chen, Tse
• Assistant Examiner(s): Lee, Yoojin
• Application Number:
  US14/045,809
• Publication Number:
  US 20150099948A1
• Time in Patent Office: 1,313 Days
• CPC Class Codes: A61B 2562/046 in a matrix array
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.

Claims

1. A flexible embedded sensor array, comprising:

a first substrate for allowing transmission from a plurality of sensors;

a plurality of electrically conductive pads disposed on at least a portion of the first substrate, wherein each sensor from the plurality of sensors is disposed on a corresponding electrically conductive pad from the plurality of electrically conductive pads, such that only a portion of each sensor is in contact with the corresponding electrically conductive pad;

an electrically non-conductive adhesive material disposed on the first substrate and in proximity to one or more of the plurality of sensors, and further in proximity to the portion of each sensor that is in contact with the corresponding electrically conductive pad;

a second substrate disposed at a distance from the first substrate, such that each of the plurality of sensors is disposed in a cavity defined by the first substrate and the second substrate;

an electrically conductive material layer disposed in the cavity on a front side of the second substrate; and

an electrical contact disposed on a back side of the second substrate to provide electrical contact to the plurality of sensors through the electrically conductive material layer,

wherein each sensor is controlled through an electrical connection provided by the corresponding electrically conductive pad.

2. The flexible embedded sensor array of claim 1, wherein the flexible embedded sensor array is configured to bend.

3. The flexible embedded sensor array of claim 1, wherein the first substrate, the second substrate, or both the first and second substrates comprise a film.

4. The flexible embedded sensor array of claim 1, wherein the plurality of electrically conductive pads comprises flexible circuits.

5. The flexible embedded sensor array of claim 1, wherein the first substrate is a transmission substrate for allowing at least a portion of emitted signal response from one or more sensors of the plurality of sensors to pass through the first substrate, and wherein a material of the first substrate is optically transparent to a wavelength of light emitted by the plurality of sensors.

6. The flexible embedded sensor array of claim 1, wherein the plurality of sensors comprises emitters, detectors, or both emitters and detectors.

7. The flexible embedded sensor array of claim 1, wherein the plurality of sensors comprises light emitting diodes, transmitters, photodiodes, photodetectors, resistors, capacitors, amplifiers, transistors, individual integrated circuits, or combinations thereof.

8. The flexible embedded sensor array of claim 1, wherein the electrically non-conductive adhesive is configured to form bonds upon exposure to a determined temperature, a determined pressure, or both determined temperature and determined pressure.

9. The flexible embedded sensor array of claim 1, further comprising a first layer disposed on the first substrate to define a cavity on the first substrate for each of the plurality of sensors, and wherein the cavity on the front side of the second substrate defines a contact area between a portion of each of the plurality of sensors and the electrically conductive material layer.

10. The flexible embedded sensor array of claim 1, wherein the electrically conductive layer is configured to electrically couple each sensor in the plurality of sensors to the electrical contact.

11. The flexible embedded sensor array of claim 1, wherein the electrical contact is a common electrical contact between two or more of the plurality of sensors.

12. The flexible embedded sensor array of claim 1, wherein the electrical contact acts as a thermal plane for at least a portion of the plurality of sensors.