Golf ball with RFID inlay between a split core

• US 9,643,056 B2
• Filed: 04/11/2012
• Issued: 05/09/2017
• Est. Priority Date: 08/18/2010
• Status: Expired due to Fees

• Current Assignee: Edge Technologies, Inc
• Original Assignee: Edge Technologies, Inc
• Inventors: White, Warren, Grieshaber, David, Luciano, Jr., Robert
• Primary Examiner(s): BLOUNT, ERIC
• Application Number:
  US13/444,660
• Publication Number:
  US 20120255998A1
• Time in Patent Office: 1,854 Days
• Field of Search: 473150, 473151, 463 30, 463 31, 463 35, 463 37, 345700, 345873, 3405728
• CPC Class Codes: A63B 2024/0037 on a target surface or at impact on the ground
• CPC Class Codes: A63B 2220/10 Positions
• CPC Class Codes: A63B 2225/15 with identification means that can be read by electronic means
• CPC Class Codes: A63B 2225/54 Transponders, e.g. RFID
• CPC Class Codes: A63B 37/0003 Golf balls
• CPC Class Codes: A63B 43/00 Balls with special arrangements
• CPC Class Codes: B29C 43/027 having an axis of symmetry B29C43/102 takes precedence
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence

Abstract

A compressible core with an RFID tag is described. The compressible core comprises an RFID integrated circuit, and an inlay material sandwiched between a top hemisphere and a bottom hemisphere. The RFID integrated circuit includes a memory that stores a unique identifier. The inlay material includes an RFID antenna electrically coupled to the RFID integrated circuit. The top hemisphere of the compressible core is separated from the bottom hemisphere of the compressible core. The inlay with the RFID antenna and the RFID integrated circuit placed between the top and bottom hemispheres. The top hemisphere, the inlay and the bottom hemisphere are joined together forming a compressible core. Additionally, the molded shell encapsulates the compressible core.

Claims

1. A ball apparatus comprising:

a compressible core that includes,

an RFID integrated circuit that includes a memory configured to store at least one unique identifier;

a planar flexible substrate carrier material configured to receive the RFID integrated circuit on a planar surface thereof;

an RFID antenna electrically coupled to the RFID integrated circuit, the RFID antenna being planar and circular, the RFID antenna disposed on the flexible substrate carrier material;

the flexible substrate carrier material with the RFID antenna and the RFID integrated circuit coupled to a compressible material.

2. The ball apparatus of claim 1 further comprising a molded shell that encapsulates the joined carrier material and the compressible material.

3. The ball apparatus of claim 1 wherein the RFID antenna is electrically coupled to the RFID integrated circuit with a conductive material.

4. The ball apparatus of claim 1 wherein the RFID antenna is electrically coupled to the RFID integrated circuit with a non-conductive adhesive.

5. The ball apparatus of claim 1 wherein the compressible material comprises a slug that is placed into a mold, which is then subjected to heating to form the compressible core.

6. The ball apparatus of claim 1 wherein the compressible material comprises a spherical core that has been split into a top hemisphere and a bottom hemisphere, wherein the carrier material is sandwiched between the hemispheres and is then placed in a mold that joins the top hemisphere, the carrier material and the bottom hemisphere.

7. The ball apparatus of claim 1 wherein the RFID antenna includes a conductive wire electrically coupled to the RFID integrated circuit.