×

Insert molded splits in housings

  • US 9,643,349 B2
  • Filed: 09/27/2013
  • Issued: 05/09/2017
  • Est. Priority Date: 09/27/2013
  • Status: Active Grant
First Claim
Patent Images

1. A phone, comprising:

  • a housing comprising;

    a first housing portion;

    a second housing portion; and

    a split coupling the first and second housing portions, the split comprising;

    a guide extending from the first and second housing portions; and

    fiber filled plastic injection molded around the guide;

    wherein the housing is positioned around a perimeter of a touch screen.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×