Compact memory device

• US 9,645,617 B2
• Filed: 11/06/2013
• Issued: 05/09/2017
• Est. Priority Date: 11/06/2013
• Status: Active Grant

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Inventors: Zychal, Anthony J., Chow, Meredith L., Martinez, Renae
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): AHMED, NASIR UDDIN
• Application Number:
  US14/073,432
• Publication Number:
  US 20150124391A1
• Time in Patent Office: 1,280 Days
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: G06F 1/206 comprising thermal management

Abstract

A memory device comprising a temperature sensor mounted on a surface of a substrate, the temperature sensor in electrical communication with a heating element and configured to activate the heating element in response to detecting a temperature below a predetermined temperature threshold. The heating element is in thermal communication with a solid state memory configured to store computer readable data. A universal serial bus (USB) driver is also mounted to the substrate, in electrical communication with the memory, and configured to communicate with another USB device via a USB channel in order to transfer data to and from the memory. The memory device can be enclosed in a protective backshell canister connected to the MIL-DTL-38999 type connector to provide a fully ruggedized, fully sealed device to withstand and operate effectively in extreme environmental conditions.

Claims

1. A memory device comprising:

a backshell canister, wherein the backshell canister comprises;

a substrate having a temperature sensor, a heating element, a universal serial bus (USB) driver and a solid state memory to store computer readable data mounted thereon,

wherein the temperature sensor is in electrical communication with the heating element and wherein the temperature sensor configured to;

activate the heating element in response to detecting a temperature at the surface of the substrate that is below a predetermined temperature threshold; and

deactivate the heating element in response to detecting a temperature at the surface of the substrate that is at or above the predetermined temperature threshold;

wherein the heating element is in thermal communication with a solid state memory mounted on the substrate configured to store computer readable data; and

a connector mated to the backshell canister, wherein the mated connector and backshell canister provide a protective enclosure to shield the contents from environmental conditions.

2. The memory device of claim 1, wherein the substrate is a printed circuit board.

3. The memory device of claim 1, wherein the USB driver is in electrical communication with the solid state memory.

4. The memory device of claim 3, wherein the USB driver is configured to operate on a predetermined protocol level mode.

5. The memory device of claim 4, wherein the predetermined protocol level mode is the High-Speed USB protocol.

6. The memory device of claim 5, wherein the USB driver is configured to communicate with another USB device via a USB channel in order to transfer data to and from the solid state memory.

7. The memory device of claim 1, wherein the predetermined temperature threshold is about −

40 degrees Celsius.

8. The memory device of claim 1 configured to operate in a temperature range from about −

54 degrees Celsius to about +85 degrees Celsius.

9. The memory device of claim 1, further comprising an electromagnetic interference (EMI) gasket, the EMI gasket positioned proximal to a side of the substrate to shield the substrate from EMI.

10. The memory device of claim 1, wherein the connector is a MIL-DTL-38999 type connector.

11. The memory device of claim 10, wherein outer edges of the substrate are adhered to an interior edge of the backshell canister.

12. The memory device of claim 11, wherein the protective backshell canister and the-MIL-DTL-38999 type connector provide a fully ruggedized, fully enclosed, sealed device to withstand and operate effectively in at least two of extreme temperatures, atmospheric variations, high shock, high vibration, excessive humidity, dust, chemical exposures and explosive environments.

13. The memory device of claim 1, wherein one or more leads from the substrate to external components are routed proximal to the heating element to facilitate thermal conduction.

14. The memory device of claim 1, wherein the substrate is encapsulated by a temperature resistant potting material.

15. The memory device of claim 1, wherein the heater is a resistive heater.

16. A system comprising:

a backshell canister, wherein the backshell canister comprises;

a substrate to mount one or more electrical components, each electrical component connected to at least one other electrical component, wherein the electrical components include a temperature sensor, a heating element, a universal serial bus (USB) driver and a solid state memory to store computer readable data, wherein the temperature sensor is in electrical communication with the heating element and configured to;

activate the heating element in response to detecting a temperature at the surface of the substrate that is below a predetermined temperature threshold; and

deactivate the heating element in response to detecting a temperature at the surface of the substrate that is at or above the predetermined temperature threshold, the heating element in thermal communication with the solid state memory; and

a connector mated to the backshell canister, wherein the mated connector and backshell canister provide a protective enclosure to shield the contents from environmental conditions.

17. The system of claim 16, further comprising a universal serial bus (USB) device that communicates with another USB device via a USB channel in order to transfer data to and from the solid state memory.

18. The system of claim 17, wherein the USB device operates on a predetermined protocol level mode that is the High-Speed USB protocol.

19. The system of claim 16, wherein the connector is a MIL-DTL-38999 type connector.

20. A compact rugged USB memory system comprising:

a backshell canister, wherein the backshell canister comprises;

a substrate to mount one or more electrical components, each electrical component connected to at least one other electrical component, the electrical components including a temperature sensor in electrical communication with a heating element, and a universal serial bus (USB) driver in electrical communication with a solid state memory to store computer readable data, wherein the temperature sensor is configured to;

activate the heating element in response to detecting a temperature at the surface of the substrate that is below a predetermined temperature threshold; and

deactivate the heating element in response to detecting a temperature at the surface of the substrate that is at or above the predetermined temperature threshold, and wherein the heating element is in thermal communication with the solid state memory;

a gasket proximal to the substrate to shield the substrate from electromagnetic interference; and

a series of leads in electrical communication with the electrical components, the series of leads being routed from a side of the substrate opposite the gasket to provide communication with another USB device; and

a MIL-DTL-38999 type connector mated to the backshell canister to provide a fully ruggedized, fully enclosed, sealed device to withstand and operate effectively in at least two of extreme temperatures, atmospheric variations, high shock, high vibration, excessive humidity, dust, chemical exposures and explosive environments.