Booster antenna, contactless chip arrangement, antenna structure and chip arrangement

• US 9,646,242 B2
• Filed: 02/28/2014
• Issued: 05/09/2017
• Est. Priority Date: 03/01/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Hofer, Guenter, Holweg, Gerald, Pachler, Walther
• Primary Examiner(s): LY, TOAN C
• Application Number:
  US14/192,895
• Publication Number:
  US 20140246503A1
• Time in Patent Office: 1,166 Days
• Field of Search: 235492
• CPC Class Codes: G06K 19/07767 the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/30 Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/20 Two collinear substantially straight active elements; Substantially straight single active elements H01Q9/28 takes precedence
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

In various embodiments, a booster antenna for a chip arrangement is provided. The booster antenna includes: a first circuit, which forms a first resonant circuit; a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit; and a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit.

Claims

1. A booster antenna for a chip arrangement, the booster antenna comprising:

a first circuit, which forms a first resonant circuit with a first phase resonance;

a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit;

a third circuit, which forms a third resonant circuit with a third phase resonance, wherein the third circuit forms a dipole antenna, wherein the dipole antenna is not short-circuited; and

wherein the dipole antenna comprises an inverted F antenna; and

wherein the second circuit comprises a coil comprising at least one coil turn where an end of an innermost coil turn is directly connected to an end of an electrical line of the dipole antenna.

2. The booster antenna of claim 1,

wherein the second circuit forms the second resonant circuit with a second absolute resonance.

3. The booster antenna of claim 2,

wherein the first electrical circuit and the second electrical circuit are designed such that at least one of the first phase resonance or the second absolute resonance is or are approximately 13.56 MHz.

4. The booster antenna of claim 1,

wherein the third electrical circuit is designed such that the third phase resonance is greater than the first phase resonance.

5. The booster antenna of claim 1,

wherein the third electrical circuit is designed such that the third phase resonance is in a range of approximately 0.3 GHz to approximately 3 GHz.

6. The booster antenna of claim 1,

wherein the second electrical circuit has an inductive coupling structure.

7. The booster antenna of claim 1,

wherein the first electrical circuit is connected in series with the second electrical circuit.

8. The booster antenna of claim 1,

wherein the first resonant circuit is a series resonant circuit.

9. The booster antenna of claim 1,

wherein the second resonant circuit is a parallel resonant circuit.

10. The booster antenna of claim 1, further comprising:

a flexible carrier;

wherein the first electrical circuit, the second electrical circuit and the third electrical circuit are arranged on the flexible carrier.

11. A contactless chip arrangement, comprising:

a booster antenna comprising;

a first circuit, which forms a first resonant circuit with a first phase resonance;

a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit;

a third circuit, which forms a third resonant circuit with a third phase resonance, wherein the third circuit forms a dipole antenna, wherein the dipole antenna is not short-circuited;

wherein the dipole antenna comprises an inverted F antenna; and

wherein the second circuit comprises a coil comprising at least one coil turn where an end of an innermost coil turn is directly connected to an end of an electrical line of the dipole antenna;

a contactless chip module, which comprises;

a chip; and

a coil, which is electrically coupled to the chip;

wherein the booster antenna is inductively coupled to the coil of the contactless chip module, by means of at least one inductive coupling region of the booster antenna.

12. The contactless chip arrangement of claim 11,

wherein the booster antenna has at least one further coupling region for coupling to a write and/or read device.

13. The contactless chip arrangement of claim 12,

wherein the first electrical circuit forms the further coupling region for coupling to at least one of a write device or read device.

14. The contactless chip arrangement of claim 12,

wherein the further coupling region for coupling to at least one of a write device or read device is formed by a dipole.

15. The contactless chip arrangement of claim 12,

wherein the inductive coupling region of the booster antenna for coupling to a chip is arranged completely within the further coupling region for coupling to at least one of a write device or read device.

16. The contactless chip arrangement of claim 12,

wherein the inductive coupling region of the booster antenna for coupling to a chip is arranged completely outside the further coupling region for coupling to a at least one of a write device or read device.

17. The contactless chip arrangement of claim 11,

wherein the inductive coupling region is part of the second electrical circuit;

and

wherein the inductive coupling region is arranged substantially congruently with the contactless chip module.

18. The contactless chip arrangement of claim 11,

wherein the contactless chip module further has chip contacts, which are designed to provide a contact-based chip interface.

19. The contactless chip arrangement of claim 11,

designed as a dual-interface chip module arrangement.