Semiconductor device, manufacturing method, and electronic apparatus
First Claim
Patent Images
1. A semiconductor device, comprising:
- an image pickup device;
a cover glass, wherein the image pickup device and the cover glass are bonded to one another;
a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and
a transparent resin filled between the image pickup device and the cover glass,wherein the film is configured to cover an entire area of the transparent resin within a pixel region.
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Abstract
A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.
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Citations
12 Claims
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1. A semiconductor device, comprising:
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an image pickup device; a cover glass, wherein the image pickup device and the cover glass are bonded to one another; a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and a transparent resin filled between the image pickup device and the cover glass, wherein the film is configured to cover an entire area of the transparent resin within a pixel region. - View Dependent Claims (2, 3, 4, 9, 10, 11, 12)
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5. A method of manufacturing a semiconductor device, the method comprising:
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forming, on a cover glass, a film that has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device, wherein the film is configured to cover an entire area of the transparent resin within a pixel region. - View Dependent Claims (6, 7)
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8. An electronic apparatus provided with a semiconductor device and a signal processing section, wherein the signal processing section is configured to process a pixel signal outputted from the semiconductor device, the semiconductor device comprising:
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an image pickup device; a cover glass, wherein the image pickup device and the cover glass are bonded to one another; a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and a transparent resin filled between the image pickup device and the cover glass, wherein the film is configured to cover an entire area of the transparent resin within a pixel region.
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Specification