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Semiconductor device, manufacturing method, and electronic apparatus

  • US 9,647,146 B2
  • Filed: 02/25/2014
  • Issued: 05/09/2017
  • Est. Priority Date: 03/08/2013
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • an image pickup device;

    a cover glass, wherein the image pickup device and the cover glass are bonded to one another;

    a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and

    a transparent resin filled between the image pickup device and the cover glass,wherein the film is configured to cover an entire area of the transparent resin within a pixel region.

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