Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

• US 9,647,171 B2
• Filed: 09/05/2014
• Issued: 05/09/2017
• Est. Priority Date: 05/12/2009
• Status: Active Grant

• Current Assignee: Board of Trustees of The University of Illinois
• Original Assignee: Board of Trustees of The University of Illinois
• Inventors: Rogers, John A., Nuzzo, Ralph, Kim, Hoon-sik, Brueckner, Eric, Park, Sang Il, Kim, Rak Hwan
• Primary Examiner(s): TRINH, MICHAEL MANH
• Application Number:
  US14/479,100
• Publication Number:
  US 20150132873A1
• Time in Patent Office: 977 Days
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68386 Separation by peeling
• CPC Class Codes: H01L 2224/8312 Aligning
• CPC Class Codes: H01L 2224/83868 Infrared [IR] curing
• CPC Class Codes: H01L 2224/83871 Visible light curing
• CPC Class Codes: H01L 2224/83874 Ultraviolet [UV] curing
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/05432 Al2O3
• CPC Class Codes: H01L 2924/06 : Polymers
• CPC Class Codes: H01L 2924/12033 : Gunn diode
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/13063 : Metal-Semiconductor Field-Effect Transistor [MESFET]
• CPC Class Codes: H01L 2924/13064 : High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/2064 : larger or equal to 1 micron less than 100 microns
• CPC Class Codes: H01L 2924/20641 : larger or equal to 100 microns less than 200 microns
• CPC Class Codes: H01L 2933/0041 : relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 33/0093 : Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: Y10S 438/977 : Thinning or removal of substrate

Abstract

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

Claims

1. A method for making a printable electronic device on a device substrate, said method comprising the steps of:

providing a printable electronic device having a contact area, wherein said printable electronic device is anchored to a host substrate via one or more homogeneous or heterogeneous anchors;

contacting said contact area of said printable electronic device with a contact surface of a conformable transfer device, wherein said contact surface of said conformable transfer device has an area smaller than said contact area of said printable electronic device, and wherein said contact area and said contact surface are aligned off center from each other, wherein contact between said contact surface and said contact area binds said printable electronic device to said contact surface;

separating said printable electronic device and said host substrate, thereby releasing said one or more homogeneous or heterogeneous anchors;

contacting said printable electronic device disposed on said contact surface with a receiving surface of said device substrate; and

separating said contact surface of said conformable transfer device and said printable electronic device, wherein said printable electronic device is transferred onto said receiving surface, thereby assembling said printable electronic device on said receiving surface of said device substrate.

2. The method of claim 1, wherein said contact surface of said conformable transfer device is less than 50% of said contact area of said electronic device.

3. The method of claim 1, wherein said contact surface of said conformable transfer device is 25% to 75% of said contact area of said electronic device.

4. The method of claim 1, wherein said contact area and said contact surface are aligned off center from each other by at least 1 μ

m.

5. The method of claim 1, wherein said contact area and said contact surface are aligned off center from each other by 1 μ

m to 100 μ

m.

6. The method of claim 1, wherein said contact surface is provided on a relief feature of said conformable transfer device.

7. The method of claim 1, wherein said conformable transfer device comprises a plurality of relief features providing a plurality of contact regions;

said method comprising;

providing a plurality of printable electronic devices each having a contact area, wherein each of said printable electronic devices is anchored to a host substrate via one or more homogeneous or heterogeneous anchors;

contacting said contact areas of said printable electronic devices with said contact regions of said conformable transfer device, wherein each of said contact regions of said conformable transfer device has an area smaller than said each of contact areas of said printable electronic device, and wherein said contact areas and said contact regions are aligned off center from each other, wherein contact between said contact regions and said contact areas binds said printable electronic devices to said contact regions;

separating said printable electronic devices and said host substrate, thereby releasing said homogeneous or heterogeneous anchors;

contacting said printable electronic devices disposed on said contact regions with a receiving surface of said device substrate; and

separating said contact surfaces of said conformable transfer device and said printable electronic devices, wherein said printable electronic devices are transferred onto said receiving surface, thereby assembling said printable electronic devices on said receiving surface of said device substrate.

8. The method of claim 1, wherein said conformable transfer device is a PDMS stamp.

9. The method of claim 1, wherein said electronic device is a P-N junction, a thin film transistor, a single junction solar cell, a multi-junction solar cell, a photodiode, a light emitting diode, a laser, a CMOS device, a MOSFET device, a MESFET device, a photovoltaic cell, a microelectromechanical device, a HEMT device or any combination of these.

10. The method of claim 1, wherein said device substrate is a glass substrate, a polymer substrate, a semiconductor substrate, a metal substrate or a ceramic substrate.

11. The method of claim 1, wherein said device substrate is a flexible substrate, a large area substrate, a pre-metalized substrate, a substrate pre-patterned with one or more device components, or any combination of these.

12. The method of claim 1, wherein said host substrate comprises a material selected from the group consisting of:

polymer, glass, plastic, semiconductor, sapphire, ceramic or any combination of these.

13. The method of claim 1, wherein said one or more heterogeneous anchors comprise a resist material.

14. The method of claim 1, wherein said step of separating said printable electronic device and said host substrate comprises fracturing said one or more homogeneous or heterogeneous anchors.