Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
First Claim
1. A method for making a printable electronic device on a device substrate, said method comprising the steps of:
- providing a printable electronic device having a contact area, wherein said printable electronic device is anchored to a host substrate via one or more homogeneous or heterogeneous anchors;
contacting said contact area of said printable electronic device with a contact surface of a conformable transfer device, wherein said contact surface of said conformable transfer device has an area smaller than said contact area of said printable electronic device, and wherein said contact area and said contact surface are aligned off center from each other, wherein contact between said contact surface and said contact area binds said printable electronic device to said contact surface;
separating said printable electronic device and said host substrate, thereby releasing said one or more homogeneous or heterogeneous anchors;
contacting said printable electronic device disposed on said contact surface with a receiving surface of said device substrate; and
separating said contact surface of said conformable transfer device and said printable electronic device, wherein said printable electronic device is transferred onto said receiving surface, thereby assembling said printable electronic device on said receiving surface of said device substrate.
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Accused Products
Abstract
Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
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Citations
14 Claims
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1. A method for making a printable electronic device on a device substrate, said method comprising the steps of:
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providing a printable electronic device having a contact area, wherein said printable electronic device is anchored to a host substrate via one or more homogeneous or heterogeneous anchors; contacting said contact area of said printable electronic device with a contact surface of a conformable transfer device, wherein said contact surface of said conformable transfer device has an area smaller than said contact area of said printable electronic device, and wherein said contact area and said contact surface are aligned off center from each other, wherein contact between said contact surface and said contact area binds said printable electronic device to said contact surface; separating said printable electronic device and said host substrate, thereby releasing said one or more homogeneous or heterogeneous anchors; contacting said printable electronic device disposed on said contact surface with a receiving surface of said device substrate; and separating said contact surface of said conformable transfer device and said printable electronic device, wherein said printable electronic device is transferred onto said receiving surface, thereby assembling said printable electronic device on said receiving surface of said device substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification