Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
First Claim
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1. An electronics system comprising an encapsulated integrated circuit, the encapsulated integrated circuit comprising:
- a lead frame;
an integrated circuit (IC) chip mounted on the lead frame, the IC chip having transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC chip are coupled to the transceiver input/output (IO) circuitry;
an antenna structure coupled to the IO circuitry via the bond pads; and
mold material encapsulating the IC chip and the antenna structure, wherein the antenna structure is positioned so as to be adjacent an interface edge of the encapsulated IC chip;
wherein the antenna structure comprises a radiating element on one surface of a substrate and a reflector element on an opposite surface of the substrate.
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Abstract
An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/output (IO) circuitry. An antenna structure is coupled to the IO circuitry via the bond pads. Mold material encapsulates the IC die and the antenna structure, wherein the antenna structure is positioned so as to be approximately in alignment with a core of a dielectric waveguide positioned adjacent the encapsulated IC.
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Citations
11 Claims
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1. An electronics system comprising an encapsulated integrated circuit, the encapsulated integrated circuit comprising:
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a lead frame; an integrated circuit (IC) chip mounted on the lead frame, the IC chip having transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC chip are coupled to the transceiver input/output (IO) circuitry; an antenna structure coupled to the IO circuitry via the bond pads; and mold material encapsulating the IC chip and the antenna structure, wherein the antenna structure is positioned so as to be adjacent an interface edge of the encapsulated IC chip; wherein the antenna structure comprises a radiating element on one surface of a substrate and a reflector element on an opposite surface of the substrate. - View Dependent Claims (2, 3, 4, 5)
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6. An electronics system comprising an encapsulated integrated circuit, the encapsulated integrated circuit comprising:
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a lead frame; an integrated circuit (IC) chip mounted on the lead frame, the IC chip having transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC chip are coupled to the transceiver input/output (IO) circuitry; an antenna structure coupled to the IO circuitry via the bond pads; and mold material encapsulating the IC chip and the antenna structure, wherein the antenna structure is positioned so as to be adjacent an interface edge of the encapsulated IC chip; a substrate having a top surface, wherein the encapsulated IC is mounted on the top surface of the substrate; and a dielectric waveguide (DWG) formed on the top surface of the substrate with an end of the DWG adjacent to the interface edge of the encapsulate IC; wherein the DWG has a second antenna structure embedded in the end of the DWG.
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7. A method for fabricating an integrated circuit, the method comprising:
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forming a lead frame strip; mounting a plurality of integrated circuit (IC) chips on the lead frame, wherein the plurality of IC chips are arranged as pairs such that one IC chip in each pair is rotated 180 degrees with respect to an adjacent IC chip in the pair; coupling an antenna structure between each pair of IC chips; encapsulating the lead frame strip, plurality of IC chips, and antenna structures with a molding compound; and singulating the encapsulated lead frame strip to form a plurality of encapsulated IC chips, such that each antenna structure is cut in half at an interface edge of the plurality of encapsulated ICs. - View Dependent Claims (8, 9, 10, 11)
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Specification