Radio frequency identification controlled heatable objects

• US 9,648,975 B2
• Filed: 01/28/2014
• Issued: 05/16/2017
• Est. Priority Date: 04/28/2004
• Status: Active Grant

• Current Assignee: Imura International Incorporated
• Original Assignee: Imura International USA Incorporated (Imura International)
• Inventors: Imura, Mamoru
• Primary Examiner(s): JENNISON, BRIAN W
• Application Number:
  US14/166,245
• Publication Number:
  US 20140182460A1
• Time in Patent Office: 1,204 Days
• CPC Class Codes: A47J 36/00 Parts, details or accessories of cooking-vessels A47J27/00 - A47J33/00 take precedence insofar as these parts, details or accessories are restricted to a particular kind of cooking-vessel provided for in a single one of these groups
• CPC Class Codes: A47J 36/321 the electronic control being performed over a network, e.g. by means of a handheld device
• CPC Class Codes: A47J 45/068 Handles having indicating means, e.g. for temperature A47J45/07 takes precedence
• CPC Class Codes: A47J 45/07 of detachable type separate handles, devices for gripping hot cooking utensils A47J45/10
• CPC Class Codes: A47J 45/071 Saucepan, frying-pan handles
• CPC Class Codes: G06K 19/0717 the sensor being capable of sensing environmental conditions such as temperature history or pressure
• CPC Class Codes: G06K 7/10336 the antenna being of the near field type, inductive coil
• CPC Class Codes: H04B 5/77 for interrogation
• CPC Class Codes: H05B 1/0266 Cooktops
• CPC Class Codes: H05B 1/0269 For heating of fluids
• CPC Class Codes: H05B 2213/06 Cook-top or cookware capable of communicating with each other
• CPC Class Codes: H05B 6/101 for local heating of metal pieces
• CPC Class Codes: H05B 6/12 Cooking devices

Abstract

A temperature controlled heatable object is provided in which a temperature sensor is connected to a Radio Frequency Identification (RFID) tag. The RFID tag is located within the handle of the object, and the temperature sensor is placed in contact with the object. In a first embodiment of the invention, the temperature sensor is partially imbedded within the object via a notch located in the side of the object. In a second embodiment of the invention, a temperature sensor is imbedded within a tunnel drilled within the base of the object. In a third embodiment, a temperature sensor is imbedded between the bottom of the object and a slab attached to the bottom of the object. The sensor can be located in a slot formed in either the slab or the bottom or the object. Handles and receivers for mounting the handles to the temperature controllable objects are also provided.

Claims

1. A heatable object comprising:

a temperature sensor placed in contact with a heatable portion of the object; and

a microprocessor associated with said temperature sensor and located outside of a heat-generation zone for the object, said microprocessor being operable to calculate a temperature of the object based on temperature information obtained by said temperature sensor,

wherein said temperature sensor is at least partially imbedded in a tunnel in said heatable portion of the object such that there are at least three points of contact between said temperature sensor and a heatable portion of the object, each point of contact being associated with a different surface of the tunnel.

2. The heatable object as claimed in claim 1 wherein said temperature sensor is placed in contact with a primary heat-distribution layer of said heatable portion of the object.

3. The heatable object as claimed in claim 2 wherein said primary heat-distribution layer comprises an aluminum core for the object.

4. The heatable object as claimed in claim 3 wherein said heatable portion of the object further comprises a ferromagnetic layer associated with said aluminum core.

5. The heatable object as claimed in claim 1 wherein said heatable portion of the object comprises a primary base portion and a slab attached to a surface of said primary base portion, and wherein said temperature sensor is located between said primary base portion and said slab.

6. The heatable object as claimed in claim 5 wherein the tunnel in which said temperature sensor is located is formed between said base portion and said slab of the object.

7. The heatable object as claimed in claim 1 wherein said heatable portion of the object is heated by magnetic induction.

8. The heatable object as claimed in claim 1 wherein said microprocessor is located within a handle of the object.

9. The heatable object as claimed in claim 1 wherein the object comprises a cookware object.

10. The heatable object as claimed in claim 1 wherein the object comprises a servingware object.

11. A heatable object comprising:

a temperature sensor at least partially imbedded within a heatable portion of the object; and

a microprocessor associated with said temperature sensor, said microprocessor being operable to calculate a temperature of the object based on temperature information obtained by said temperature sensor,

wherein said temperature sensor is at least partially imbedded within a notch in said heatable portion of the object such that there are at least three points of contact between said temperature sensor and a heatable portion of the object, each point of contact being associated with a different surface of the notch.

12. The heatable object as claimed in claim 11 wherein said microprocessor is located remote from said heatable portion of the object.

13. The heatable object as claimed in claim 11 wherein said heatable portion of the object comprises a primary base portion and a slab attached to a surface of said primary base portion, and wherein said temperature sensor is located between said primary base portion and said slab.

14. The heatable object as claimed in claim 13 wherein the notch in which said temperature sensor is located is formed in said base portion of the object.

15. The heatable object as claimed in claim 13 wherein the notch in which said temperature sensor is located is formed in said slab.

16. The heatable object as claimed in claim 11 wherein said heatable portion of the object is heated by magnetic induction.

17. The heatable object as claimed in claim 11 wherein said microprocessor is located within a handle of the object.

18. The heatable object as claimed in claim 11 wherein the object comprises a cookware object.

19. The heatable object as claimed in claim 11 wherein the object comprises a servingware object.

20. A heatable object comprising:

a primary base portion;

a slab attached to a surface of said primary base portion;

a temperature sensor located between said primary base portion and said slab such that there are at least three points of contact between said temperature sensor and a heatable portion of the object, each point of contact being associated with a different surface of said primary base portion and said slab; and

a microprocessor associated with said temperature sensor and located outside of a heat-generation zone for the object, said microprocessor being operable to calculate a temperature of the object based on the temperature information obtained by said temperature sensor.