Differential carrier temperature sensing method
First Claim
1. A differential carrier temperature sensing package comprising:
- a package housing comprising an upper portion and a lower portion connected together to form a sealed package housing, the upper portion and the lower portion in thermally conductive contact with an environment external to a differential carrier housing, the lower portion in thermally conductive contact with an outer surface of the differential carrier housing, and the lower portion extended through an opening in the differential carrier housing, wherein the lower portion is in thermally conductive contact with fluid within the differential housing;
an electronic circuit attached to the upper portion within the package housing and in thermally conductive contact with the upper portion of the package housing;
a first temperature sensor disposed on and in thermally conductive contact with the electronic circuit and in thermally conductive contact with a thermal conductor imbedded in and in thermally conductive contact with the lower portion, the lower portion in thermally conductive contact with fluid within the differential housing; and
a second temperature sensor disposed on the electronic circuit, wherein a measured differential carrier fluid temperature TSNS, a measured internal package housing temperature TPCB, a known housing plus thermal conductor thermal resistance RENC, and a known thermal conductor resistance of the housing at the electronic circuit board RPCB are utilized to determine an internal differential carrier temperature TINT, by way of the equation TINT=TSNS (1 RENC/RPCB)−
TPCB (RENC/RPCB).
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Accused Products
Abstract
A method of sensing an internal temperature of a differential carrier includes providing a differential carrier temperature sensing package with an electronic circuit board having a first temperature sensor that is in thermally conductive contact with a thermal conductor, where the thermal resistance of the package and thermal conductor is given and known as RENC. The package is extended through an opening in a differential carrier that has a fluid in it. The first temperature sensor senses a differential fluid temperature TSNS. The electronic circuit board further has a second temperature sensor, whereby the thermal resistance of the circuit board is a given known resistance RPCB. The second temperature sensor senses an internal package temperature TPCB within the package. Consequently, an internal temperature of the differential is calculated from the equation: TINT=TSNS(1 RENC/RPCB)−TPCB(RENC/RPCB).
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Citations
16 Claims
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1. A differential carrier temperature sensing package comprising:
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a package housing comprising an upper portion and a lower portion connected together to form a sealed package housing, the upper portion and the lower portion in thermally conductive contact with an environment external to a differential carrier housing, the lower portion in thermally conductive contact with an outer surface of the differential carrier housing, and the lower portion extended through an opening in the differential carrier housing, wherein the lower portion is in thermally conductive contact with fluid within the differential housing; an electronic circuit attached to the upper portion within the package housing and in thermally conductive contact with the upper portion of the package housing; a first temperature sensor disposed on and in thermally conductive contact with the electronic circuit and in thermally conductive contact with a thermal conductor imbedded in and in thermally conductive contact with the lower portion, the lower portion in thermally conductive contact with fluid within the differential housing; and a second temperature sensor disposed on the electronic circuit, wherein a measured differential carrier fluid temperature TSNS, a measured internal package housing temperature TPCB, a known housing plus thermal conductor thermal resistance RENC, and a known thermal conductor resistance of the housing at the electronic circuit board RPCB are utilized to determine an internal differential carrier temperature TINT, by way of the equation TINT=TSNS (1 RENC/RPCB)−
TPCB (RENC/RPCB). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A differential carrier temperature sensing package, comprising:
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a package housing comprising an upper portion and a lower portion connected together to form a sealed package housing, the upper portion and lower portion of the package housing in thermally conductive contact with an environment external to a differential carrier housing, the lower portion of the package housing also in thermally conductive contact with an outer surface of the differential housing, and the lower portion of the package housing extends through an opening in the differential housing, wherein the lower portion is in thermally conductive contact with a fluid within the differential housing; an electronic circuit attached to the upper portion within the package housing and in thermally conductive contact therewith; a first temperature sensor disposed on the electronic circuit and in thermally conductive contact with an outward projection of the lower portion of the package housing, the lower portion of the package housing in thermally conductive contact with a thermal conductor disposed in the fluid within the differential housing; and a second temperature sensor disposed on the electronic circuit, wherein a measured differential carrier fluid temperature TSNS, a measured internal package temperature TPCB, a known housing plus thermal conductor thermal resistance RENC, and a known thermal conductor resistance of the housing at the electronic circuit board RPCB are utilized to determine an internal differential carrier temperature TINT, by way of the equation TINT=TSNS (1 RENC/RPCB)−
TPCB (RENC/RPCB). - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification