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Differential carrier temperature sensing method

  • US 9,651,142 B2
  • Filed: 03/05/2014
  • Issued: 05/16/2017
  • Est. Priority Date: 03/11/2013
  • Status: Expired due to Fees
First Claim
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1. A differential carrier temperature sensing package comprising:

  • a package housing comprising an upper portion and a lower portion connected together to form a sealed package housing, the upper portion and the lower portion in thermally conductive contact with an environment external to a differential carrier housing, the lower portion in thermally conductive contact with an outer surface of the differential carrier housing, and the lower portion extended through an opening in the differential carrier housing, wherein the lower portion is in thermally conductive contact with fluid within the differential housing;

    an electronic circuit attached to the upper portion within the package housing and in thermally conductive contact with the upper portion of the package housing;

    a first temperature sensor disposed on and in thermally conductive contact with the electronic circuit and in thermally conductive contact with a thermal conductor imbedded in and in thermally conductive contact with the lower portion, the lower portion in thermally conductive contact with fluid within the differential housing; and

    a second temperature sensor disposed on the electronic circuit, wherein a measured differential carrier fluid temperature TSNS, a measured internal package housing temperature TPCB, a known housing plus thermal conductor thermal resistance RENC, and a known thermal conductor resistance of the housing at the electronic circuit board RPCB are utilized to determine an internal differential carrier temperature TINT, by way of the equation TINT=TSNS (1 RENC/RPCB)−

    TPCB (RENC/RPCB).

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