Partially filled contact and trace layout
First Claim
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1. An apparatus, comprising:
- a first layer comprising a first conductive material having a first coefficient of thermal expansion; and
a second layer, adjacent to the first layer, the second layer comprising a continuous body formed from a second conductive material having a second coefficient of thermal expansion, wherein the second layer is partially filled and comprises a first surface area of the continuous body formed from the second conductive material and a number of open voids extending through the continuous body to the first layer, the open voids representing a second surface area and the first layer at least partially overlapping the number of open voids in the second layer, wherein the first surface area is approximately three times greater than the second surface area.
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Abstract
An apparatus including a first layer formed from a first conductive material having a first coefficient of thermal expansion and a second layer, coupled to the first layer, the second layer formed from a second conductive material having a second coefficient of thermal expansion, where the second layer is partially filled.
16 Citations
19 Claims
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1. An apparatus, comprising:
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a first layer comprising a first conductive material having a first coefficient of thermal expansion; and a second layer, adjacent to the first layer, the second layer comprising a continuous body formed from a second conductive material having a second coefficient of thermal expansion, wherein the second layer is partially filled and comprises a first surface area of the continuous body formed from the second conductive material and a number of open voids extending through the continuous body to the first layer, the open voids representing a second surface area and the first layer at least partially overlapping the number of open voids in the second layer, wherein the first surface area is approximately three times greater than the second surface area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a partially filled contact between two layers of conductive material, comprising:
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forming a first layer comprising a first conductive material having a first coefficient of thermal expansion; and forming a second layer, adjacent to the first layer, the second layer comprising a continuous body formed from a second conductive material having a second coefficient of thermal expansion, wherein the second layer is partially filled and comprises a first surface area of the continuous body formed from the second conductive material and a number of open voids extending through the continuous body to the first layer, the open voids representing a second surface area and the first layer at least partially overlapping the number of open voids in the second layer, wherein the first surface area is approximately three times greater than the second surface area. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. An apparatus comprising:
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a processing device; and a touch sensor panel coupled to the processing device, the touch sensor panel comprising; a sensor layer comprising a continuous body formed from formed from a transparent conductive material; and a trace layer adjacent to the sensor layer, the trace layer formed from a metal, wherein the trace layer is partially filled and comprises a first surface area of the continuous body formed from the metal and a number of open voids extending through the continuous body to the sensor layer, wherein the number of open voids are evenly distributed throughout the trace layer, wherein the open voids represent a second surface area and the sensor layer at least partially overlaps the number of open voids in the trace layer, wherein the first surface area is approximately three times greater than the second surface area, and wherein an electronic signal is passed from the sensor layer through the trace layer to the processing device, wherein the processing device identifies a touch on the touch sensor panel using the electronic signal. - View Dependent Claims (18, 19)
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Specification