Fabrication of touch sensor panel using laser ablation

• US 9,652,088 B2
• Filed: 07/30/2010
• Issued: 05/16/2017
• Est. Priority Date: 07/30/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Harley, Jonah A.
• Primary Examiner(s): Yuan, Dah-Wei D
• Assistant Examiner(s): Law, Nga Leung V
• Application Number:
  US12/847,987
• Publication Number:
  US 20120026099A1
• Time in Patent Office: 2,482 Days
• Field of Search: 2191216, 427554, 427555, 345173
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer

Abstract

Fabrication of a touch sensor panel using laser ablation is disclosed. The fabricated touch sensor panel can have its touch sensors formed from conductive layers disposed on a surface such as an undersurface of the panel'"'"'s cover substrate. A fabrication method can include ablating a first conductive layer to define the first part of the touch sensors and then ablating a second conductive layer proximate to the first conductive layer to define the second part of the touch sensors. The touch sensor panel can be incorporated into a mobile telephone, a digital media player, or a personal computer.

Claims

1. A method comprising:

ablating a first conductive layer to define first portions of touch sensors and a first plurality of dummy regions, the first portions connected by multiple crossover regions, wherein each dummy region of the first plurality of dummy regions is formed entirely by portions of the first conductive layer, and wherein each dummy region of the first plurality of dummy regions is electrically isolated from the first portions of touch sensors;

after ablating the first conductive layer, depositing a dielectric layer onto the first conductive layer, wherein the first portions of touch sensors and the first plurality of dummy regions are completely covered by the dielectric layer; and

after depositing the dielectric layer onto the first conductive layer, ablating a second conductive layer proximate to the first conductive layer to define second portions of the touch sensors and a second plurality of dummy regions, the second portions connected by multiple crossover regions, wherein each dummy region of the second plurality of dummy regions is formed entirely by portions of the second conductive layer, wherein each dummy region of the second plurality of dummy regions is electrically isolated from the second portions of touch sensors, wherein the first and second portions cross over at the respective crossover regions, wherein the first portions of touch sensors and the second plurality of dummy regions overlap, and wherein the second portions of touch sensors and the first plurality of dummy regions overlap.

2. The method of claim 1, wherein ablating the first conductive layer comprises defining either drive lines or sense lines of the touch sensors.

3. The method of claim 1, wherein ablating the second conductive layer comprises defining either drive lines or sense lines of the touch sensors.

4. The method of claim 1, wherein ablating the first conductive layer comprises separating the first conductive layer into electrically connected regions and electrically disconnected regions, the electrically connected regions comprising the first portions of the touch sensors.

5. The method of claim 1, wherein ablating the second conductive layer comprises separating the second conductive layer into electrically connected regions and electrically disconnected regions, the electrically connected regions comprising the second portions of the touch sensors.

6. The method of claim 1, comprising depositing a mask around a boundary of at least one of the first and second conductive layers.

7. The method of claim 1, comprising forming a first set of contacts on the first portions of the touch sensors and a second set of contacts on the second portions of the touch sensors to electrically contact touch circuitry.

8. The method of claim 1, wherein the crossover regions are narrower than the first and second portions to reduce unwanted capacitive coupling between the first and second portions.

9. A method comprising:

depositing a first conductive layer onto a substrate;

laser ablating the first conductive layer to create gaps in the first conductive layer that divide the first conductive layer into a first touch sensing pattern and a first plurality of dummy regions, wherein each dummy region of the first plurality of dummy regions is formed entirely by portions of the first conductive layer, and wherein each dummy region of the first plurality of dummy regions is electrically isolated from the first touch sensing pattern;

depositing a dielectric layer onto the first conductive layer, wherein the first touch sensing pattern and the first plurality of dummy regions are covered by the dielectric layer;

depositing a second conductive layer onto the dielectric layer; and

laser ablating the second conductive layer to create gaps in the second conductive layer that divide the second conductive layer into a second touch sensing pattern and a second plurality of dummy regions, wherein each dummy region of the second plurality of dummy regions is formed entirely by portions of the second conductive layer, wherein each dummy region of the second plurality of dummy regions is electrically isolated from the second touch sensing pattern, wherein the first plurality of dummy regions at least partially overlap the second touch sensing pattern, and wherein the second plurality of dummy regions at least partially overlap the first touch sensing pattern.

10. The method defined in claim 9, wherein laser ablating the first conductive layer comprises removing strips of the first conductive layer, and wherein laser ablating the second conductive layer comprises removing strips of the second conductive layer.