Chip-type antenna device and chip structure

• US 9,652,649 B2
• Filed: 07/02/2014
• Issued: 05/16/2017
• Est. Priority Date: 07/02/2014
• Status: Active Grant

• Current Assignee: Auden Techno Corp.
• Original Assignee: Auden Techno Corp.
• Inventors: Lai, Shih-Chi, Chien, Tzu-Hsiang, Yang, Cheng-Min
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): SALIH, AWAT M
• Application Number:
  US14/321,898
• Publication Number:
  US 20160006125A1
• Time in Patent Office: 1,049 Days
• Field of Search: 343700 MS, 343702, 343846, 343720, 343841, 343848, 343872, 257701, 257723, 257724, 257725, 257728
• CPC Class Codes: G06K 7/10396 the interrogation device being wearable, e.g. as a glove, bracelet, or ring wearable aerials in general H01Q1/27
• CPC Class Codes: G06K 7/10554 Moving beam scanning
• CPC Class Codes: G06K 7/10722 Photodetector array or CCD scanning
• CPC Class Codes: G06K 7/10891 the scanner to be worn on a finger or on a wrist
• CPC Class Codes: G06K 7/1091 means to wake up the scanner from a sleep mode, e.g. using an acceleration sensor indicating that the scanner is being picked up by a user
• CPC Class Codes: G06K 7/1443 locating of the code in an image
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/52 Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure absorbing means H01Q17/00
• CPC Class Codes: H01Q 9/045 with particular feeding means for circular polarisation H01Q9/0428
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

A chip structure for mounting on a clearance area of a printed circuit board includes a packaged chip and a monopole coupling antenna. The packaged chip has an insulating body, an electronic component embedded in the insulating body, and a plurality of grounding pads electrically connected to the electronic component. The monopole coupling antenna has a grounding radiating metal and a monopole radiating metal. The packaged chip is electrically connected to the grounding radiating metal by the grounding pads. The monopole radiating metal is disposed on the insulating body and spaced apart from the electronic component and the grounding radiating metal. The monopole radiating metal is configured to couple the grounding radiating metal and the electronic component by using a feeding circuit to connect the packaged chip and the monopole radiating metal and using a grounding circuit to connect the grounding radiating metal and the printed circuit board.

Claims

1. A chip-type antenna device, comprising:

a circuit board having a grounding portion;

a packaged chip having an insulating body and at least one electronic component embedded in the insulating body, wherein the packaged chip has a plurality of grounding pads and a plurality of signal pads, the grounding pads and the signal pads are arranged on a bottom surface of the packaged chip and are electrically connected to the electronic component;

a monopole coupling antenna, comprising;

a grounding radiating metal disposed on the circuit board, wherein the grounding pads are connected to the grounding radiating metal; and

a monopole radiating metal disposed on the insulating body of the packaged chip, the monopole radiating metal having a feeding point arranged on the bottom surface of the packaged chip, wherein the monopole radiating metal is arranged apart from the electronic component and the grounding radiating metal, the insulating body structurally and electrically isolates the monopole radiating metal from the electronic component, and the monopole radiating metal does not contact any conductor embedded in the insulating body;

a grounding circuit formed on the circuit board and connected to the grounding portion of the circuit board and the grounding radiating metal; and

a feeding circuit disposed on the circuit board;

wherein the packaged chip and the monopole radiating metal disposed on the insulating body are mounted on the circuit board, the feeding circuit is electrically connected to the feeding point of the monopole radiating metal and one of the signal pads of the packaged chip, and the grounding pads are connected to the grounding radiating metal;

wherein the monopole radiating metal is configured to non-contact coupling with the grounding radiating metal and the electronic component when the packaged chip transmits a signal to the monopole radiating metal via the feeding circuit.

2. The chip-type antenna device as claimed in claim 1, wherein the packaged chip has a substrate, the electronic component is disposed on the substrate, the grounding pads and the signal pads are formed on the substrate;

wherein the monopole radiating metal has a main portion and a supporting portion, the supporting portion bents and extends from the main portion, and the supporting portion is disposed on the substrate.

3. The chip-type antenna device as claimed in claim 2, wherein the monopole radiating metal is arranged apart from the electronic component with a predetermined distance therebetween, the main portion is arranged on a top surface of the package structure, the supporting portion is embedded in the insulating body.

4. The chip-type antenna device as claimed in claim 3, wherein a distance between the electronic component and the top surface of the packaged chip is smaller than the predetermined distance, the main portion is arranged outside an area of the top surface, and the area of the top surface is defined by an orthogonal projection of the electronic component onto the top surface.

5. The chip-type antenna device as claimed in claim 3, wherein the grounding pads are arranged in an area of the bottom surface, and the area of the bottom surface is defined by an orthogonal projection of the grounding radiating metal onto the bottom surface.

6. The chip-type antenna device as claimed in claim 1, wherein the circuit board defines a clearance area thereon, the packaged chip and the monopole coupling antenna are disposed on the clearance area of the circuit board.

7. The chip-type antenna device as claimed in claim 6, wherein the feeding circuit has a matching circuit arranged on the circuit board outside the clearance area.

8. A chip structure for mounting on a clearance area of a circuit board, comprising:

a packaged chip having an insulating body and at least one electronic component embedded in the insulating body, wherein the packaged chip has a plurality of grounding pads arranged on a bottom surface of the packaged chip, and the plurality of grounding pads are electrically connected to the electronic component; and

a monopole coupling antenna, comprising;

a grounding radiating metal for being disposed on the clearance area of the circuit board, wherein the grounding pads are connected to the grounding radiating metal; and

a monopole radiating metal disposed on the insulating body of the packaged chip, the monopole radiating metal having a feeding point arranged on the bottom surface of the packaged chip, wherein the monopole radiating metal is arranged apart from the electronic component and the grounding radiating metal, the insulating body structurally and electrically isolates the monopole radiating metal from the electronic component, and the monopole radiating metal does not contact any conductor embedded in the insulating body;

wherein when the packaged chip is electrically connected to the feeding point of the monopole radiating metal by a feeding circuit, and the grounding radiating metal is connected to the circuit board by a grounding circuit, the packaged chip transmits a signal to the monopole radiating metal via the feeding circuit, and the monopole radiating metal is coupled in a non-contact manner with the grounding radiating metal and the electronic component during.

9. The chip structure as claimed in claim 8, wherein the packaged chip has a substrate, the electronic component is disposed on the substrate, the grounding pads are formed on the substrate;

wherein the monopole radiating metal has a main portion and a supporting portion, the supporting portion bents and extends from the main portion, and the supporting portion is disposed on the substrate.

10. The chip structure as claimed in claim 9, wherein the grounding pads are arranged in an area of the bottom surface, and the area of the bottom surface is defined by an orthogonal projection of the electronic component onto the bottom surface, wherein the monopole radiating metal is arranged apart from the electronic component with a predetermined distance therebetween, the main portion is arranged on a top surface of the package chip, the supporting portion is embedded in the insulating body, and wherein the distance between the electronic component and the top surface of the packaged chip is smaller than the predetermined distance, the main portion is arranged outside an area of the top surface, and the area of the top surface is defined by an orthogonal projection of the grounding radiating metal onto the top surface.