Testing method, manufacturing method, and testing device of memory device
First Claim
1. A testing method of a memory device, comprising:
- annealing the memory device, the memory device including a memory element, the memory element including a first ferromagnetic layer, a second ferromagnetic layer, a third ferromagnetic layer, a first nonmagnetic layer, and a second nonmagnetic layer, the first nonmagnetic layer being disposed between the first ferromagnetic layer and the second ferromagnetic layer, and the second nonmagnetic layer being disposed between the second ferromagnetic layer and the third ferromagnetic layer;
performing, after the annealing, to the memory element a process which sets a first magnetization orientation of the first ferromagnetic layer to be antiparallel to a second magnetization orientation of the second ferromagnetic layer;
reading, after the performing of the process which sets the first magnetization orientation to be antiparallel to the second magnetization orientation, data from the memory element; and
determining the memory element as defective due to the second magnetization orientation being parallel to a third magnetization orientation of the third ferromagnetic layer, when data represented by the first magnetization orientation being antiparallel to the second magnetization orientation differs from the read data.
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Abstract
According to one embodiment, a testing method of a memory device includes annealing the memory device, the memory device including a memory element; performing, after the annealing, to the memory element a process which sets a first magnetization orientation of a first ferromagnetic layer to be antiparallel to a second magnetization orientation of the second ferromagnetic layer; reading, after the performing of the process, data from the memory element; and determining the memory element as defective due to the second magnetization orientation being parallel to a third magnetization orientation of a third ferromagnetic layer, when data represented by the first magnetization orientation being antiparallel to the second magnetization orientation differs from the read data.
12 Citations
19 Claims
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1. A testing method of a memory device, comprising:
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annealing the memory device, the memory device including a memory element, the memory element including a first ferromagnetic layer, a second ferromagnetic layer, a third ferromagnetic layer, a first nonmagnetic layer, and a second nonmagnetic layer, the first nonmagnetic layer being disposed between the first ferromagnetic layer and the second ferromagnetic layer, and the second nonmagnetic layer being disposed between the second ferromagnetic layer and the third ferromagnetic layer; performing, after the annealing, to the memory element a process which sets a first magnetization orientation of the first ferromagnetic layer to be antiparallel to a second magnetization orientation of the second ferromagnetic layer; reading, after the performing of the process which sets the first magnetization orientation to be antiparallel to the second magnetization orientation, data from the memory element; and determining the memory element as defective due to the second magnetization orientation being parallel to a third magnetization orientation of the third ferromagnetic layer, when data represented by the first magnetization orientation being antiparallel to the second magnetization orientation differs from the read data. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A testing device of a memory device, comprising an annealing unit, and a function tester including a writing circuit, a reading circuit and a determining circuit,
wherein the annealing unit is configured to anneal the memory device including a memory element, the memory element including a first ferromagnetic layer, a second ferromagnetic layer, a third ferromagnetic layer, a first nonmagnetic layer, and a second nonmagnetic layer, the first nonmagnetic layer being disposed between the first ferromagnetic layer and the second ferromagnetic layer, and the second nonmagnetic layer being disposed between the second ferromagnetic layer and the third ferromagnetic layer; -
the writing circuit is configured to perform, after a process of the annealing, to the memory element a process which sets a first magnetization orientation of the first ferromagnetic layer to be antiparallel to a second magnetization orientation of the second ferromagnetic layer; the reading circuit is configured to read, after the process of the performing which sets the first magnetization orientation to be antiparallel to the second magnetization orientation, data from the memory element; and the determining circuit is configured to determine the memory element as defective due to the second magnetization orientation being parallel to a third magnetization orientation of the third ferromagnetic layer, when data represented by the first magnetization orientation being antiparallel to the second magnetization orientation differs from the read data. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A manufacturing method of a memory device, comprising:
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forming a memory element, the memory element including a first ferromagnetic layer, a second ferromagnetic layer, a third ferromagnetic layer, a first nonmagnetic layer, and a second nonmagnetic layer, the first nonmagnetic layer being disposed between the first ferromagnetic layer and the second ferromagnetic layer, and the second nonmagnetic layer being disposed between the second ferromagnetic layer and the third ferromagnetic layer; annealing the memory device including the formed memory element; performing, after the annealing, to the memory element a process which sets a first magnetization orientation of the first ferromagnetic layer to be antiparallel to a second magnetization orientation of the second ferromagnetic layer; reading, after the performing of the process which sets the first magnetization orientation to be antiparallel to the second magnetization orientation, data from the memory element; and determining the memory element as defective due to the second magnetization orientation being parallel to a third magnetization orientation of the third ferromagnetic layer, when data represented by the first magnetization orientation being antiparallel to the second magnetization orientation differs from the read data. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification