Ceramic feedthrough brazed to an implantable medical device housing

• US 9,653,893 B2
• Filed: 01/08/2016
• Issued: 05/16/2017
• Est. Priority Date: 05/24/2013
• Status: Active Grant

• Current Assignee: Heraeus Medevio GmbH & Company KG
• Original Assignee: Heraeus Deutschland GmbH & Co. KG (Heraeus Holding GMBH)
• Inventors: Pavlovic, Goran, Markham, Jacob, Hausch, Ulrich
• Primary Examiner(s): Wieland, Robert N
• Application Number:
  US14/991,351
• Publication Number:
  US 20160126713A1
• Time in Patent Office: 494 Days
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: B23K 1/0056 soldering by means of beams, e.g. lasers, E.B.
• CPC Class Codes: H02G 1/00 Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
• CPC Class Codes: H02G 3/22 Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
• CPC Class Codes: Y10T 29/49213 Metal

Abstract

One aspect is an implantable medical device with a feedthrough assembly having an insulator and a plurality of conducting elements extending therethrough. The feedthrough assembly is placed in a case with an opening defining a narrow space therebetween. A braze material fills the narrow space, thereby hermetically sealing the feedthrough assembly to the case. One of the feedthrough assembly and the case include a feature configured to securely hold the braze and in that the implantable medical device does not include a ferrule.

Claims

1. An implantable medical device comprising:

a feedthrough assembly comprising an insulator and a plurality of conducting elements extending therethrough;

a case with an opening into which the feedthrough assembly is positioned defining a narrow space therebetween;

a braze material filling the narrow space, thereby hermetically sealing the feedthrough assembly to the case;

characterized in that the case comprises a step configured to securely hold the braze and in that the implantable medical device does not include a ferrule.

2. The implantable medical device of claim 1, wherein the feedthrough assembly comprises a top surface that is exterior to the case and the step has a surface that is parallel to the top surface of the feedthrough assembly.

3. The implantable medical device of claim 1, wherein the narrow space is no less than 10μ

m and no more than 50 μ

m.

4. The implantable medical device of claim 1, wherein the insulator and plurality of conducting elements are hermetically sealed together without solder or braze.

5. The implantable medical device of claim 4, wherein the plurality of conducting elements comprise cermet.

6. The implantable medical device of claim 4, characterized in that the feedthrough assembly includes metallization on at least one surface to control the dimensions of the braze.

7. The implantable medical device of claim 6, wherein the metallization on the feedthrough assembly controls the braze such that it is at least 0.010 inches below the top surface of the feedthrough assembly and at least 0.010 inches above a bottom surface of the feedthrough assembly.

8. An implantable medical device comprising:

a feedthrough assembly comprising an insulator and a plurality of conducting elements extending therethrough;

a case with an opening into which the feedthrough assembly is positioned defining a narrow space therebetween;

a braze material filling the narrow space, thereby hermetically sealing the feedthrough assembly to the case;

characterized in that one of the feedthrough assembly and the case comprise a step configured to securely hold the braze and in that the implantable medical device does not include a ferrule.

9. The implantable medical device of claim 8, wherein the feature is a step in the case defining a surface against which the braze material is securely held.

10. The implantable medical device of claim 8, wherein the feature is a step in the feedthrough assembly defining a surface against which the braze material is securely held.

11. The implantable medical device of claim 9, wherein the feedthrough assembly comprises a top surface that is exterior to the case and the step has a surface that is parallel to the top surface of the feedthrough assembly.

12. The implantable medical device of claim 8, wherein the narrow space is no less than 10μ

m and no more than 50 μ

m.

13. The implantable medical device of claim 8, wherein the insulator and plurality of conducting elements are hermetically sealed together without solder or braze.

14. The implantable medical device of claim 13, wherein the plurality of conducting elements comprise cermet.

15. The implantable medical device of claim 13, characterized in that the feedthrough assembly includes metallization on at least one surface to control the dimensions of the braze.

16. The implantable medical device of claim 13, wherein the metallization on the feedthrough assembly controls the braze such that it is at least 0.010 inches below the top surface of the feedthrough assembly and at least 0.010 inches above a bottom surface of the feedthrough assembly.