Method of producing electronics substrate with enhanced direct bonded metal

• US 9,655,294 B2
• Filed: 06/17/2014
• Issued: 05/16/2017
• Est. Priority Date: 07/28/2010
• Status: Active Grant

• Current Assignee: Wieland Microcool, LLC
• Original Assignee: Wolverine Tube Incorporated
• Inventors: Loong, Sy-Jenq, Smith, Donald Lynn
• Primary Examiner(s): PHAN, THIEM D
• Application Number:
  US14/307,074
• Publication Number:
  US 20140290042A1
• Time in Patent Office: 1,064 Days
• Field of Search: 36167954, 361699, 361701, 361702, 361709-711, 361688, 361689, 361704, 361706, 361707, 174252, 174548, 29854, 29557, 29832, 29840, 2989003, 29890046, 29890049, 2989005, 407113, 407114
• CPC Class Codes: B21J 5/068 Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
• CPC Class Codes: H01L 21/4878 Mechanical treatment, e.g. deforming
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 83/0341 Processes

Abstract

A substrate for electronic components is formed by bonding a cooling metal layer to one side of a ceramic tile and bonding an electronic metal layer to the other side of the electronic tile. The substrate is secured to a machining base and the cooling metal layer surface is enhanced through an MDT process. In the process, fins are sliced into the cooling metal layer with a tool to a depth of less than the cooling metal layer thickness. The slicing forces material upward without removing material from the cooling metal layer, forming fins that extend beyond the original thickness of the cooling metal layer. The fins can be cross-sliced at an angle to form pins.

Claims

1. A method of producing an electronics substrate comprising:

directly bonding a cooling metal layer to a first side of a ceramic tile, the ceramic tile comprising a thickness of between 0.28 mm and 0.61 mm, the cooling metal layer having a thickness of between 0.25 mm and 0.41 mm, and;

directly bonding an electronic metal layer to a second side of a ceramic tile;

securing the ceramic tile to a machining base such that the electronic metal layer is firmly supported;

slicing fins into the cooling metal layer with a tool to form an enhanced surface, where the tool slices into the cooling metal layer to a depth less than the cooling metal layer thickness, and where the slicing step forces sliced material upwards without removing material from the cooling metal layer.

2. The method of claim 1, wherein the tool slices into the cooling metal layer to a depth of less than 70 percent of the cooling metal layer thickness.

3. The method of claim 1 further comprising:

connecting a tub to the cooling metal layer such that a chamber is formed between the tub and the cooling metal layer, and where the enhanced surface is positioned in the chamber; and

forming a coolant inlet and a coolant outlet that penetrate the chamber.

4. The method of claim 1 further comprising:

connecting a plurality of electronic components to the electronic metal layer.

5. The method of claim 1 where the step of cutting fins into the cooling metal layer further comprises forming the fins to a fin height extending beyond an outer surface of the cooling metal layer.

6. The method of claim 1 further comprising slicing across the fins at an angle to form pins which extend beyond an outer surface of the cooling metal layer.

7. The method of claim 6, wherein the angle is between 30 and 90 degrees.

8. The method of claim 1 where the ceramic tile consists of aluminum oxide, aluminum nitride, beryllium oxide, or any combination thereof.