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Method of producing electronics substrate with enhanced direct bonded metal

  • US 9,655,294 B2
  • Filed: 06/17/2014
  • Issued: 05/16/2017
  • Est. Priority Date: 07/28/2010
  • Status: Active Grant
First Claim
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1. A method of producing an electronics substrate comprising:

  • directly bonding a cooling metal layer to a first side of a ceramic tile, the ceramic tile comprising a thickness of between 0.28 mm and 0.61 mm, the cooling metal layer having a thickness of between 0.25 mm and 0.41 mm, and;

    directly bonding an electronic metal layer to a second side of a ceramic tile;

    securing the ceramic tile to a machining base such that the electronic metal layer is firmly supported;

    slicing fins into the cooling metal layer with a tool to form an enhanced surface, where the tool slices into the cooling metal layer to a depth less than the cooling metal layer thickness, and where the slicing step forces sliced material upwards without removing material from the cooling metal layer.

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