Implantable electrode and method of making the same

• US 9,656,054 B2
• Filed: 04/01/2015
• Issued: 05/23/2017
• Est. Priority Date: 02/29/2008
• Status: Active Grant

• Current Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Original Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Inventors: Hetke, Jamille Farraye, Pellinen, David S., Gulari, Mayurachat Ning, Anderson, David J., Kipke, Daryl R., Vetter, Rio J.
• Primary Examiner(s): Kahelin, Michael
• Assistant Examiner(s): PHAM, MINH DUC GIA
• Application Number:
  US14/676,037
• Publication Number:
  US 20150201855A1
• Time in Patent Office: 783 Days
• Field of Search: 607116
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/2072 Anchoring, i.e. one structure gripping into another providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that overlaps a peripheral edge of the electrode layer. The anchor is mechanically interlocked with the insulator. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording and stimulating function.

Claims

1. An implantable electrode, comprising:

a) a first portion of an insulator layer;

b) an electrically conductive interconnect layer supported by the first portion of the insulator layer, the interconnect layer comprising an interconnect peripheral edge providing an interconnect width or diameter extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug peripheral edge providing a plug width or diameter extending between spaced apart first and second plug edges;

d) a second portion of the insulator layer supported on the first portion of the insulator layer and contacting the plug;

e) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode peripheral edge providing an electrode width or diameter extending between spaced apart first and second electrode edges; and

f) an anchor layer that overlaps only parts of the electrode layer including at least one of the first and second electrode edges, wherein the anchor layer is physically and electrically isolated from the interconnect layer and the plug layer by the insulator layer.

2. The implantable electrode of claim 1 wherein the anchor layer is of an electrically conductive material.

3. The implantable electrode of claim 1 wherein the anchor layer is of a material that acts as an electrical insulator.

4. The implantable electrode of claim 1 wherein the anchor layer is chemically bonded to the insulator layer.

5. The implantable electrode of claim 1 wherein the anchor layer is supported on an upper surface of the second portion of the insulator layer.

6. The implantable electrode of claim 1 wherein the anchor layer is spaced from the interconnect layer.

7. The implantable electrode of claim 1 wherein the anchor layer has a ring shape.

8. The implantable electrode of claim 1 wherein both the electrode layer and the anchor layer are of a metal material.

9. The implantable electrode of claim 1 wherein the electrode layer is chemically bonded to the plug layer.

10. The implantable electrode of claim 1 wherein the insulator layer is of a material that acts as an electrical insulator.

11. The implantable electrode of claim 1 wherein the second portion of the insulator layer is in an overlaying relationship with a portion of the upper interconnect surface.

12. The implantable electrode of claim 1 wherein the interconnect layer is of platinum or gold and the first and second portions of the insulator layer are a polymer selected from the group consisting of polyimide, parylene, and polydimethylsiloxane (PDMS).

13. The implantable electrode of claim 1 wherein the interconnect layer is polysilicon, the first portion of the insulator layer is an inorganic dielectric selected from silicon dioxide and silicon nitride, and the second portion of the insulator layer is a polymer selected from the group consisting of polyimide, parylene, and polydimethylsiloxane (PDMS).

14. The implantable electrode of claim 1 wherein the interconnect layer is of polysilicon, and wherein the first portion of the insulator layer is selected from the group consisting of silicon carbide, polyimide, and parylene.

15. The implantable electrode of claim 1 wherein the interconnect layer contacts the electrode layer spaced inwardly from the peripheral edge of the electrode layer.

16. The implantable electrode of claim 1 wherein the electrode layer is a neural interface that is configured to provide at least one function selected from the group consisting of recording and stimulating.

17. The implantable electrode of claim 1 wherein the second portion of the insulator layer contacts both the interconnect layer and the anchor layer and physically insulates the interconnect layer from the anchor layer.

18. The implantable electrode of claim 1 wherein the second portion of the insulator layer contacts both the plug peripheral edge and the interconnect peripheral edge.