Thermal management for light-emitting diodes

• US 9,657,931 B2
• Filed: 12/21/2011
• Issued: 05/23/2017
• Est. Priority Date: 12/21/2011
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Shah, Ketan R., Halton, Sean M.
• Primary Examiner(s): Wells, Kenneth B
• Application Number:
  US13/977,400
• Publication Number:
  US 20130285545A1
• Time in Patent Office: 1,980 Days
• Field of Search: 362294, 362373
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 29/506 of globes, bowls or cover glasses
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/745 the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
• CPC Class Codes: F21V 29/77 with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/78 with helically or spirally arranged fins or blades
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/061 the material being glass
• CPC Class Codes: F21V 3/062 the material being plastics
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 24/00 Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/642 : characterized by the shape

Abstract

Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Claims

1. A device comprising;

at least one light-emitting diode chip on a first side of a substrate;

a conical heat spreader disposed on a second side of the substrate, the conical heat spreader comprising a conical region and a plurality of fins extending from a surface of the conical region;

a transparent cover disposed over the at least one light-emitting diode chip;

a heat transfer collar disposed around the at least one light-emitting diode chip and disposed between the substrate and the transparent cover, the heat transfer collar comprising a collar region disposed on the first side of the substrate and fins that extend away from the surface of the substrate; and

a plug region disposed on the conical heat spreader and capable of making an electrical connection with an electrical socket wherein the plug region is electrically coupled to the at least one light-emitting diode chip.

2. The device of claim 1, the transparent cover comprising one or more holes to allow air to flow between an inside and an outside of the transparent cover.

3. The device of claim 1, the conical heat spreader being attached to the substrate with a thermal interface material.

4. The device of claim 1, further comprising one or more light-emitting diode driver circuits between and electrically coupled to the at least one light-emitting diode chip and the plug region.

5. The device of claim 1, wherein each of the fins extending from the conical region are double fins comprises two fins attached to the same location on the surface of the conical region.

6. A device comprising;

at least one light-emitting diode chip on a first side of a substrate;

a heat transfer collar disposed around the at least one light-emitting diode chip wherein the heat transfer collar comprises a collar region disposed on the first side of the substrate and fins that extend away from a surface of the substrate;

a transparent cover disposed over the at least one light-emitting diode chip wherein the heat transfer collar is disposed between the substrate and the transparent cover; and

a plug region capable of making an electrical connection with an electrical socket wherein the plug region is electrically coupled to the at least one light-emitting diode chip.

7. The device of claim 6, the transparent cover comprising one or more holes to allow air to flow between an inside and an outside of the transparent cover.

8. A device comprising;

at least one light-emitting diode chip on a first side of a substrate;

a heat sink attached to a second side of the substrate on a first end of the heat sink, wherein the heat sink also has a second end, an interior region, and an exterior surface;

a heat dissipater disposed around the exterior surface of the heat sink wherein the heat dissipater comprises a plurality of fins;

a transparent cover disposed over the at least one light-emitting diode chip;

a heat transfer collar disposed around the at least one light-emitting diode chip, the heat transfer collar comprising a collar region disposed on the first side of the substrate and fins that extend away from the surface of the substrate; and

a plug region disposed on the second end of heat sink and capable of making an electrical connection with an electrical socket wherein the plug region is electrically coupled to the at least one light-emitting diode chip through the interior region of the heat sink.

9. The device of claim 8, further comprising one or more light-emitting diode driver circuits between and electrically coupled to the at least one light-emitting diode chip and the plug region.

10. The device of claim 8, wherein each of the fins extending from the conical region are double fins comprises two fins that originate from the same location on the heat dissipator.