Please download the dossier by clicking on the dossier button x
×

Via stack fault detection

  • US 9,659,668 B2
  • Filed: 05/30/2014
  • Issued: 05/23/2017
  • Est. Priority Date: 05/30/2014
  • Status: Active Grant
First Claim
Patent Images

1. An apparatus for fault detection in a via stack, the apparatus comprising:

  • a plurality of dies coupled together through the via stack, each die having a reference voltage selection circuit coupled to a respective via, each die further having a circuit configured to select its respective die and enable the reference voltage selection circuit to couple a reference voltage to the respective via; and

    a connection to the via stack configured to apply a supply voltage to the via stack and measure a resulting current through the via stack.

View all claims
  • 8 Assignments
Timeline View
Assignment View
    ×
    ×