×

Stiffened wires for offset BVA

  • US 9,659,848 B1
  • Filed: 03/31/2016
  • Issued: 05/23/2017
  • Est. Priority Date: 11/18/2015
  • Status: Active Grant
First Claim
Patent Images

1. A component, comprising:

  • a generally planar element having oppositely-facing first and second surfaces extending in first and second transverse directions, the generally planar element having a plurality of contacts at the first surface;

    a reinforcing dielectric layer overlying the first surface of the generally planar element;

    an encapsulation overlying the reinforcing dielectric layer, the encapsulation having a major surface facing away from the first surface of the generally planar element; and

    a plurality of wire bonds, each wire bond having a base joined with a contact of the plurality of contacts, and a tip remote from the base at the major surface of the encapsulation, the wire bonds having first portions extending within at least a portion of the reinforcing dielectric layer and second portions extending within the encapsulation, the first portions of at least some of the wire bonds having bends that change an extension direction of the respective wire bond in at least one of the first and second directions,wherein the reinforcing dielectric layer has protruding regions surrounding respective wire bonds of the plurality of wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions, the peak heights of the protruding regions coinciding with points of contact between the reinforcing dielectric layer and individual ones of the wire bonds.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×