Stiffened wires for offset BVA
First Claim
1. A component, comprising:
- a generally planar element having oppositely-facing first and second surfaces extending in first and second transverse directions, the generally planar element having a plurality of contacts at the first surface;
a reinforcing dielectric layer overlying the first surface of the generally planar element;
an encapsulation overlying the reinforcing dielectric layer, the encapsulation having a major surface facing away from the first surface of the generally planar element; and
a plurality of wire bonds, each wire bond having a base joined with a contact of the plurality of contacts, and a tip remote from the base at the major surface of the encapsulation, the wire bonds having first portions extending within at least a portion of the reinforcing dielectric layer and second portions extending within the encapsulation, the first portions of at least some of the wire bonds having bends that change an extension direction of the respective wire bond in at least one of the first and second directions,wherein the reinforcing dielectric layer has protruding regions surrounding respective wire bonds of the plurality of wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions, the peak heights of the protruding regions coinciding with points of contact between the reinforcing dielectric layer and individual ones of the wire bonds.
2 Assignments
0 Petitions
Accused Products
Abstract
A component can include a generally planar element, a reinforcing dielectric layer overlying the generally planar element, an encapsulation overlying the reinforcing dielectric layer, and a plurality of wire bonds. Each wire bond can have a tip at a major surface of the encapsulation. The wire bonds can have first portions extending within the reinforcing dielectric layer. The first portions of at least some of the wire bonds can have bends that change an extension direction of the respective wire bond. The reinforcing dielectric layer can have protruding regions surrounding respective ones of the wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions. The peak heights of the protruding regions can coincide with points of contact between the reinforcing dielectric layer and individual wire bonds.
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Citations
21 Claims
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1. A component, comprising:
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a generally planar element having oppositely-facing first and second surfaces extending in first and second transverse directions, the generally planar element having a plurality of contacts at the first surface; a reinforcing dielectric layer overlying the first surface of the generally planar element; an encapsulation overlying the reinforcing dielectric layer, the encapsulation having a major surface facing away from the first surface of the generally planar element; and a plurality of wire bonds, each wire bond having a base joined with a contact of the plurality of contacts, and a tip remote from the base at the major surface of the encapsulation, the wire bonds having first portions extending within at least a portion of the reinforcing dielectric layer and second portions extending within the encapsulation, the first portions of at least some of the wire bonds having bends that change an extension direction of the respective wire bond in at least one of the first and second directions, wherein the reinforcing dielectric layer has protruding regions surrounding respective wire bonds of the plurality of wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions, the peak heights of the protruding regions coinciding with points of contact between the reinforcing dielectric layer and individual ones of the wire bonds. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A microelectronic package, comprising:
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a generally planar element having oppositely-facing first and second surfaces extending in first and second transverse directions, the generally planar element having a plurality of contacts at the first surface; a reinforcing dielectric layer overlying the first surface of the generally planar element; an encapsulation overlying the reinforcing dielectric layer, the encapsulation having a major surface facing away from the first surface of the generally planar element; a microelectronic element having oppositely-facing top and bottom surfaces, the bottom surface facing the first surface of the generally planar element and mechanically coupled therewith, the major surface of the encapsulation overlying the top surface of the microelectronic element; and a plurality of wire bonds, each wire bond having a base joined with a contact of the plurality of contacts, and a tip remote from the base at the major surface of the encapsulation, the wire bonds having first portions extending within at least a portion of the reinforcing dielectric layer and second portions extending within the encapsulation, the first portions of at least some of the wire bonds having bends that change an extension direction of the respective wire bond in at least one of the first and second directions, wherein the reinforcing dielectric layer extends to a greater peak height from the first surface of the generally planar element than the microelectronic element. - View Dependent Claims (15, 16)
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17. A method of forming a component, comprising:
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providing a generally planar element having oppositely-facing first and second surfaces extending in first and second transverse directions, the generally planar element having a plurality of contacts at the first surface; forming a plurality of wire bonds, each wire bond having a base joined with a contact of the plurality of contacts and a tip remote from the base, first portions of at least some of the wire bonds having bends that change an extension direction of the respective wire bond in at least one of the first and second directions; forming a reinforcing dielectric layer overlying the first surface of the generally planar element, the first portions of the wire bonds extending within at least a portion of the reinforcing dielectric layer, the reinforcing dielectric layer having protruding regions surrounding respective wire bonds of the plurality of wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions, the peak heights of the protruding regions coinciding with points of contact between the reinforcing dielectric layer and individual ones of the wire bonds; flowing an encapsulation between the reinforcing dielectric layer and a lower surface of a molding film into which tips of the wire bonds extend, the encapsulation having a major surface facing away from the first surface of the generally planar element, the wire bonds having second portions extending within the encapsulation; and removing the molding film from the encapsulation, the tips of the wire bonds being at the major surface of the encapsulation. - View Dependent Claims (18, 19, 20, 21)
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Specification