Oxide semiconductor thin film transistor including oxygen release layer
First Claim
1. A semiconductor device comprising:
- a gate electrode;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film;
a source electrode and a drain electrode in electrical contact with the oxide semiconductor film; and
an inorganic insulating film over the oxide semiconductor film, the source electrode, and the drain electrode,wherein the gate insulating film comprises at least a silicon oxynitride film and a first oxygen release type oxide film over the silicon oxynitride film,wherein the inorganic insulating film comprises at least a second oxygen release type oxide film and a metal oxide film over the second oxygen release type oxide film,wherein the metal oxide film comprises aluminum oxide,wherein the metal oxide film comprising the aluminum oxide has a film density of higher than or equal to 3.2 g/cm3 measured by Rutherford backscattering spectrometry,wherein an amount of oxygen released from each of the first oxygen release type oxide film and the second oxygen release type oxide film, which is converted to oxygen atoms is greater than or equal to 1×
1020 atoms/cm3 in a thermal desorption spectroscopy, andwherein the oxide semiconductor film is formed in contact with the first oxygen release type oxide film.
1 Assignment
0 Petitions
Accused Products
Abstract
Provided is a semiconductor device including an oxide semiconductor and having stable electrical characteristics. Specifically, a semiconductor device including an oxide semiconductor and including a gate insulating film with favorable characteristics is provided. Further, a method for manufacturing the semiconductor device is provided. The semiconductor device includes a gate electrode, a gate insulating film over the gate electrode, an oxide semiconductor film over the gate insulating film, and a source electrode and a drain electrode in contact with the oxide semiconductor film. The gate insulating film includes at least a silicon oxynitride film and an oxygen release type oxide film which is formed over the silicon oxynitride film. The oxide semiconductor film is formed on and in contact with the oxygen release type oxide film.
234 Citations
11 Claims
-
1. A semiconductor device comprising:
-
a gate electrode; a gate insulating film over the gate electrode; an oxide semiconductor film over the gate insulating film; a source electrode and a drain electrode in electrical contact with the oxide semiconductor film; and an inorganic insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, wherein the gate insulating film comprises at least a silicon oxynitride film and a first oxygen release type oxide film over the silicon oxynitride film, wherein the inorganic insulating film comprises at least a second oxygen release type oxide film and a metal oxide film over the second oxygen release type oxide film, wherein the metal oxide film comprises aluminum oxide, wherein the metal oxide film comprising the aluminum oxide has a film density of higher than or equal to 3.2 g/cm3 measured by Rutherford backscattering spectrometry, wherein an amount of oxygen released from each of the first oxygen release type oxide film and the second oxygen release type oxide film, which is converted to oxygen atoms is greater than or equal to 1×
1020 atoms/cm3 in a thermal desorption spectroscopy, andwherein the oxide semiconductor film is formed in contact with the first oxygen release type oxide film. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A semiconductor device comprising:
-
a gate electrode; a gate insulating film over the gate electrode; an oxide semiconductor film over the gate insulating film; a source electrode and a drain electrode in electrical contact with the oxide semiconductor film; an inorganic insulating film over the oxide semiconductor film, the source electrode, and the drain electrode; an organic insulating film over the inorganic insulating film; and wherein the gate insulating film comprises at least a silicon oxynitride film and a first oxygen release type oxide film over the silicon oxynitride film, wherein the inorganic insulating film comprises at least a second oxygen release type oxide film and a metal oxide film over the second oxygen release type oxide film, wherein the first oxygen release type oxide film is a film of SiOx where x>
2,wherein a thickness of the silicon oxynitride film is thicker than that of the first oxygen release type oxide film, wherein the oxide semiconductor film is formed in contact with the first oxygen release type oxide film, wherein the metal oxide film comprises aluminum oxide, wherein the metal oxide film comprising the aluminum oxide has a film density of higher than or equal to 3.2 g/cm3 measured by Rutherford backscattering spectrometry, and wherein an amount of oxygen released from each of the first oxygen release type oxide film and the second oxygen release type oxide film, which is converted to oxygen atoms is greater than or equal to 1×
1020 atoms/cm3 in a thermal desorption spectroscopy. - View Dependent Claims (8, 9, 10, 11)
-
Specification