Gap engineering for flip-chip mounted horizontal LEDs

• US 9,660,153 B2
• Filed: 05/20/2011
• Issued: 05/23/2017
• Est. Priority Date: 11/14/2007
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Emerson, David Todd, Rosado, Raymond, Donofrio, Matthew, Edmond, John Adam
• Primary Examiner(s): Nadav, Ori
• Application Number:
  US13/112,502
• Publication Number:
  US 20120193661A1
• Time in Patent Office: 2,195 Days
• Field of Search: 257 79- 81, 257 98-100
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.

Claims

1. A light emitting device comprising:

a light emitting diode die including spaced apart anode and cathode contacts that extend along a face thereof;

a mounting substrate including spaced apart anode and cathode pads on a surface of the mounting substrate, the light emitting diode die being flip chip mounted on the mounting substrate such that the anode contact is adjacent and conductively bonded to the anode pad and the cathode contact is adjacent and conductively bonded to the cathode pad to define a gap comprising a top gap that extends along the face between the spaced apart anode and cathode contacts and a bottom gap that extends along the surface of the mounting substrate between the spaced apart anode and cathode pads; and

an encapsulant on the light emitting diode die, wherein the encapsulant expands during heating thereof and enters the gap;

wherein the top gap has a first shape, width, and length that extends along the face of the light emitting diode die, the bottom gap comprises a portion that extends along the surface of the mounting substrate and under the face of the light emitting diode die, the portion of the bottom gap having a second shape, width, and length, and the first shape and length of the top gap are substantially the same as the second shape and length of the portion of the bottom gap;

wherein the spaced apart anode and cathode pads comprise curved facing surfaces so that the bottom gap comprises a curved portion, and the curved portion is at a location beyond the face of the light emitting diode die; and

wherein the gap has a geometric configuration that prevents a sufficient amount of the encapsulant from entering the gap such that expansion of the encapsulant that has entered the gap does not debond the light emitting device from the substrate, and the geometric configuration comprises the curved portion of the gap.

2. A light emitting device according to claim 1 wherein the geometric configuration of the gap further comprises one or more of a height, width, length, aspect ratio or shape of the gap.

3. A light emitting device according to claim 1 wherein a filler material that is different from the encapsulant is provided in the gap.

4. A light emitting device according to claim 3 wherein the filler material comprises one or more of a silicone-based material or a solder stop material.

5. A light emitting device according to claim 2 wherein the gap includes constricted openings.

6. A light emitting device according to claim 1 wherein the spaced apart anode and cathode contacts extend along the face of the light emitting diode die to substantially cover the face of the light emitting diode die.

7. A light emitting device according to claim 1 further comprising:

a lens that extends from the mounting substrate to surround the light emitting diode die;

wherein the encapsulant extends between the lens and the mounting substrate.

8. A light emitting device according to claim 1 wherein the gap comprises at least two curved portions.

9. A light emitting device according to claim 1 wherein the bottom gap has a length greater than the top gap.

10. A light emitting device according to claim 1 wherein a ratio of the first width of the top gap to the second width of the bottom gap is about 0.5 to about 1.

11. A light emitting device according to claim 1 wherein a ratio of the first width of the top gap to the second width of the bottom gap is about 1.

12. A light emitting device according to claim 1 wherein the gap has a width between 10 μ

m to 75 μ

m.

13. A light emitting device according to claim 1 wherein the gap has a height of between 30 μ

m and 200 μ

m.

14. A light emitting device according to claim 1 wherein the gap has an aspect ratio between 0.4 and 4.

15. A light emitting device according to claim 1 wherein the gap has a cross-sectional area of between 2,000 μ

m² and 40,000 μ

m².

16. A light emitting device according to claim 1 wherein the curved portion of the gap comprises a corner.

17. A light emitting device according to claim 1 wherein the top gap and the portion of the bottom gap are free of a curved portion.

18. A light emitting device according to claim 1 wherein the anode contact is directly bonded to the anode pad, and the cathode contact is directly bonded to the cathode pad.