Multiferroic surface acoustic wave antenna

• US 9,660,349 B2
• Filed: 06/29/2015
• Issued: 05/23/2017
• Est. Priority Date: 06/29/2015
• Status: Active Grant

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Inventors: Keller, Scott Macklin, Nordeen, Paul Killian, Wetzlar, Kyle, Moon, Michael F., Burnside, Scott Richard, Carman, Gregory Paul
• Primary Examiner(s): Mai, Lam T
• Application Number:
  US14/753,330
• Publication Number:
  US 20160380357A1
• Time in Patent Office: 694 Days
• Field of Search: 343731, 343787
• CPC Class Codes: G01R 33/093 using multilayer structures, e.g. giant magnetoresistance sensors thin magnetic films H01F10/00
• CPC Class Codes: G01R 33/098 comprising tunnel junctions, e.g. tunnel magnetoresistance sensors
• CPC Class Codes: H01Q 11/02 Non-resonant antennas, e.g. travelling-wave antenna Yagi antennas H01Q19/30
• CPC Class Codes: H01Q 9/04 Resonant antennas
• CPC Class Codes: H03H 9/25 Constructional features of resonators using surface acoustic waves devices for manipulating acoustic surface waves in general G10K11/36

Abstract

A method of fabricating a multiferroic antenna element may include providing a electroelastic substrate to transform mechanical oscillations into an acoustic wave, providing a resonator assembly on a surface of the electroelastic substrate where the resonator assembly includes a plurality of magnetoelastic resonators that transform an electromagnetic wave into mechanical oscillations corresponding to a frequency of the electromagnetic wave, and providing an interdigitated electrode assembly at a portion of the electroelastic substrate to convert the acoustic wave into an electrical signal preserving information associated with the frequency of the electromagnetic wave.

Claims

1. A multiferroic antenna element comprising:

a resonator assembly comprising a magnetoelastic resonator that transform an electromagnetic wave into mechanical oscillations corresponding to a frequency of the electromagnetic wave;

an electroelastic substrate operably coupled to the magnetoelastic resonator to transform the mechanical oscillations into an electrical output; and

an electrode assembly operably coupled to the electroelastic substrate to allow monitoring of the electrical output.

2. The multiferroic antenna element of claim 1, wherein the magnetoelastic resonator is an array of elements that generate an acoustic wave in the electroelastic substrate.

3. The multiferroic antenna element of claim 1, wherein the electrode assembly comprises an interdigitated electrode assembly.

4. The multiferroic antenna element of claim 1, wherein the electrical output preserves information associated with the frequency of the electromagnetic wave.

5. The multiferroic antenna element of claim 1, wherein the electrical output corresponds to an acoustic wave.

6. The multiferroic antenna element of claim 1, wherein the electroelastic substrate comprises a Lithium Niobate, Quartz, AlNi, PZT, ZnO, LiTaO, or PMN-PT substrate and the magnetoelastic resonators comprise nickel, or a nickel alloy, Terfenol-D, FeGaGaFeB, FeGaGaFe, YIG, CoFe, CoFeB, Metglass , NiZnFeO, MnZnFeO, MnNiZnFe, or FeCoSiB.

7. The multiferroic antenna element of claim 1, wherein physical structures associated with the resonator assembly, the electroelastic substrate and the electrode assembly are fabricated based on corresponding models generated for each structure prior to fabrication.

8. The multiferroic antenna element of claim 7, wherein the corresponding models are generated and optimized relative to an optimization variable or variables.

9. The multiferroic antenna element of claim 8, wherein the optimization variable comprises the voltage across the electrode or the electrode assembly.

10. The multiferroic antenna element of claim 7, wherein each of the corresponding models is a Finite Element Method model, or a Finite Difference Time Domain model, or a Method of Moments model, or a comparable numerical calculation method and may be coupled to a Simulation Program with Integrated Circuit Emphasis (SPICE) model or a comparable circuit simulation method.

11. The multiferroic antenna element of claim 8, wherein one of the corresponding models is a finite element model, and wherein the finite element model comprises physics modules including an Electromagetic Waves (EMW) module to model the resonator assembly, a Piezoelectric Devices (PZD) module to model the electroelastic substrate, and an Electrical Circuits (Cir) module to model the electrode assembly.

12. The multiferroic antenna element of claim 1, wherein the resonator assembly is distributed over a surface of the electroelastic substrate, and wherein electrodes of the electrode assembly are deposited on opposite sides of the electroelastic substrate.

13. The multiferroic antenna element of claim 1, wherein length and width of the multiferroic antenna element are less than a tenth of a wavelength of the electromagnetic wave length.

14. A method of realizing a multiferroic antenna element, the method comprising:

providing an electroelastic substrate to transform mechanical oscillations into an electrical output;

providing a resonator assembly on a surface of the electroelastic substrate, the resonator assembly comprising a magnetoelastic resonator that transforms an electromagnetic wave into mechanical oscillations corresponding to a frequency of the electromagnetic wave; and

providing an electrode assembly at a portion of the electroelastic substrate to monitor the electrical output for translation of the electrical output into an electrical signal.

15. The method of claim 14, wherein providing the resonator assembly comprises:

depositing a resist layer ,which is chemically sensitive to electromagnetic radiation or energetic particles, on a wafer of material corresponding to the electroelastic substrate;

lithographically patterning the resist layer by selective exposure or by using a photomask to define the areas of exposure;

removing exposed resist by immersing the wafer in a development solution or removing unexposed resist by immersing the wafer in a development solution;

definition of the magnetoelastic material by etching an existing layer or by material deposition; and

removing the resist from the wafer.

16. The method of claim 14, wherein providing the electrode assembly comprises:

depositing a resist layer ,which is chemically sensitive to electromagnetic radiation or energetic particles, on a wafer of material corresponding to the electroelastic substrate;

lithographically patterning the resist layer by selective exposure or by using a photomask to define the areas of exposure;

removing exposed resist by immersing the wafer in a development solution or removing unexposed resist by immersing the wafer in a development solution;

definition of the electrode material by etching an existing layer or by material deposition; and

removing the resist from the wafer.

17. The method of claim 14, wherein providing the electroelastic substrate, providing the resonator assembly, and providing the electrode assembly are fabricated based on corresponding models generated for each structure prior to fabrication.

18. The method of claim 17, wherein the corresponding models are generated and optimized relative to an optimization variable or variables.

19. The method of claim 17, wherein the optimization variable comprises voltage across electrodes of the electrode assembly.

20. The method of claim 17, wherein each of the corresponding models is a finite element model.