High performance surface mount electrical interconnect

• US 9,660,368 B2
• Filed: 02/13/2015
• Issued: 05/23/2017
• Est. Priority Date: 05/28/2009
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): Vu, Hien
• Application Number:
  US14/621,663
• Publication Number:
  US 20150162678A1
• Time in Patent Office: 830 Days
• Field of Search: 439 66, 439 68, 439 74, 439 83
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 12/7082 Coupling device supported only by cooperation with PCB
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

An interconnect assembly including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact member are located in the plurality of through holes. The contact members include proximal ends that are accessible from the second surface, distal ends extending above the first surface, and intermediate portions engaged with an engagement region of the substrate located between the first surface and the recesses. Retention members are coupled with at least a portion of the proximal ends to retain the contact members in the through holes. The retention members can be made from a variety of materials with different levels of conductivity, ranging from highly conductive to non-conductive.

Claims

1. An interconnect assembly comprising:

a substrate comprising a plurality of through holes extending from a first major surface to a second major surface, each through holes comprising an axis and a cross-sectional area generally perpendicular to the axis;

a plurality of recesses in the second major surface of the substrate that at least partially overlap with the plurality of through holes, each recess comprising a recess axis and a recess cross-sectional area generally perpendicular to the recess axis, the recess cross-sectional area of the recess being greater than the cross-sectional area of the through holes;

a plurality of discrete contact members in the plurality of the through holes, the contact members comprising proximal ends extending into the recesses, distal ends extending above the first major surface, and intermediate portions engaged with an engagement region of the substrate located between the first major surface and the recesses; and

a plurality of electrically conductive retention members at least partially located in the recesses and bonded the proximal ends of the contact members to retain the contact members in the through holes;

wherein a compliant material or a dielectric material is in between the retention members and at least a portion of an inner surface of the recesses.

2. The interconnect assembly of claim 1 wherein the electrically conductive retention members comprise one or more of solder, solder paste, a conductive plug, a conductive adhesive, electrical plating, or a combination thereof.

3. The interconnect assembly of claim 1 wherein the substrate comprises a plurality of layers.

4. The interconnect assembly of claim 3 wherein the substrate comprises at least one additional circuitry plane comprising one of a ground plane, a power plane, an electrical connection to other circuit members, a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.

5. The interconnect assembly of claim 1 wherein the intermediate portion of each of the plurality of contact members forms a friction fit with the engagement region of the substrate.

6. The interconnect assembly of claim 1 comprising a solder ball attached to the retention member and electrically coupled to the proximal ends of each of the plurality of contact members.

7. The interconnect assembly of claim 1 comprising:

proximal end of each of the plurality of contact members extending above the second surface; and

solder balls coupled to the proximal ends.

8. The interconnect assembly of claim 1 further comprising a layer of dielectric material bonded to the first surface of the substrate.

9. The interconnect assembly of claim 8 wherein the layer of dielectric material limits deflection of the distal ends of the plurality of contact members.

10. The interconnect assembly of claim 1 further comprising:

a plurality of conductive traces located on at least one of the first and second surfaces of the substrate and electrically coupled to the plurality of contact members; and

a dielectric layer electrically insulating the conductive traces.

11. The interconnect assembly of claim 10 wherein the plurality of conductive traces comprise distal ends with a pitch different than a pitch of the proximal ends of the plurality of contact members.

12. The interconnect assembly of claim 10 comprising a compliant layer located between one of the second surface and the plurality of conductive traces or between overlapping conductive traces.

13. The interconnect assembly of claim 10 comprising a flexible circuit member electrically coupled to the plurality of conductive traces and extending beyond a perimeter edge of the substrate.

14. The interconnect assembly of claim 10 wherein the plurality of conductive traces electrically couple the interconnect assembly with a second interconnect assembly.

15. The interconnect assembly of claim 10 comprising a plurality of electrical devices printed on at least one of the first or second surfaces of the substrate and electrically coupled to at least one of the plurality of contact members.

16. An electrical assembly comprising:

the interconnect assembly of claim 1;

a first circuit member comprising contact pads compressively engaged with the distal ends of the plurality of contact members; and

a second circuit member comprising contact pads bonded to one or more of the retention members or one or more of the proximal ends of the plurality of contact members.

17. An interconnect assembly comprising:

a substrate comprising a plurality of through holes extending from a first major surface to a second major surface, each through holes comprising an axis and a cross-sectional area generally perpendicular to the axis;

a plurality of recesses in the second major surface of the substrate that at least partially overlap with the plurality of through holes, each recess comprising a recess axis and a recess cross-sectional area generally perpendicular to the recess axis, the recess cross-sectional area of the recess being greater than the cross-sectional area of the through holes;

a plurality of discrete contact members in the plurality of the through holes, the contact members comprising proximal ends extending into the recesses, distal ends extending above the first major surface, and intermediate portions engaged with an engagement region of the substrate located between the first major surface and the recesses;

a plurality of retention members at least partially located in the recesses and

bonded the proximal ends of the contact members to retain the contact members in the through holes; and

a solder ball electrically coupled to the proximal ends of the contact members and extending above the second surface of the substrate;

wherein a complaint material or a dielectric material is in between the retention members and at least a portion of an inner surface of the recesses.