Power amplifier modules including wire bond pad and related systems, devices, and methods
First Claim
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1. A power amplifier module comprising:
- a power amplifier configured to receive a radio frequency signal and to provide an amplified radio frequency signal;
a wire bond pad electrically connected to the power amplifier by a wire bond, the wire bond pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer; and
a conductive trace having a surface with a plated portion and an unplated portion surrounding the plated portion, the wire bond pad being disposed over the plated portion.
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Abstract
One aspect of this disclosure is a power amplifier module that includes a power amplifier; a wire bond pad electrically connected to the power amplifier, the wire bond pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer; and a conductive trace having a top surface with a plated portion and an unplated portion surrounding the plated portion, the wire bond pad being disposed over the plated portion. Other embodiments of the module are provided along with related methods and components thereof.
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Citations
20 Claims
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1. A power amplifier module comprising:
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a power amplifier configured to receive a radio frequency signal and to provide an amplified radio frequency signal; a wire bond pad electrically connected to the power amplifier by a wire bond, the wire bond pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer; and a conductive trace having a surface with a plated portion and an unplated portion surrounding the plated portion, the wire bond pad being disposed over the plated portion. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A power amplifier module comprising:
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a power amplifier die on a substrate, the power amplifier die including a power amplifier configured to receive a radio frequency signal and to provide an amplified radio frequency signal; a conductive trace on the substrate, the conductive trace having a surface with a plated portion and an unplated portion, the unplated portion including an edge of the surface disposed between the plated portion and the power amplifier die; and a wire bond pad electrically connected to the power amplifier by a wire bond, the wire bond pad being disposed over the plated portion of the surface of the conductive trace, the wire bond pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A power amplifier module comprising:
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a power amplifier on a substrate and configured to provide a radio frequency signal, a conductive trace on the substrate, the conductive trace having a surface with a plated portion and an unplated portion, the conductive trace also having an unplated sidewall disposed between the power amplifier and the plated portion; and a wire bond pad electrically connected to an output of the power amplifier by a wire bond, the wire bond pad being disposed over the plated portion of the surface of the conductive trace, the wire bond pad including a diffusion barrier layer having a thickness sufficiently small such that the radio frequency signal is allowed to penetrate to the conductive trace, a barrier layer over the diffusion barrier layer, and a bonding layer over the barrier layer and bonded with the wire bond. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification