×

Integrated MEMS microphone and vibration sensor

  • US 9,661,411 B1
  • Filed: 01/25/2016
  • Issued: 05/23/2017
  • Est. Priority Date: 12/01/2015
  • Status: Active Grant
First Claim
Patent Images

1. A micro-electro-mechanical systems (MEMS) microphone and vibration sensor die comprising:

  • a die substrate;

    a MEMS microphone on the die substrate; and

    a MEMS vibration sensor on the die substrate, the MEMS vibration sensor having a plurality of beam transducers, each of the plurality of beam transducers having a beam and a proof mass, wherein each proof mass is tuned to a different resonant frequency range and comprises a same material as the die substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×