Integrated MEMS microphone and vibration sensor
First Claim
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1. A micro-electro-mechanical systems (MEMS) microphone and vibration sensor die comprising:
- a die substrate;
a MEMS microphone on the die substrate; and
a MEMS vibration sensor on the die substrate, the MEMS vibration sensor having a plurality of beam transducers, each of the plurality of beam transducers having a beam and a proof mass, wherein each proof mass is tuned to a different resonant frequency range and comprises a same material as the die substrate.
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Abstract
MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.
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Citations
20 Claims
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1. A micro-electro-mechanical systems (MEMS) microphone and vibration sensor die comprising:
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a die substrate; a MEMS microphone on the die substrate; and a MEMS vibration sensor on the die substrate, the MEMS vibration sensor having a plurality of beam transducers, each of the plurality of beam transducers having a beam and a proof mass, wherein each proof mass is tuned to a different resonant frequency range and comprises a same material as the die substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A headphone remote controller having multiple sensors, the headphone remote controller comprising:
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a housing for a remote controller of a headphone, the housing having a housing wall defining a vibration contact side for the remote controller; a multiple sensor package positioned within the housing, the multiple sensor package comprising a micro-electro-mechanical systems (MEMS) microphone, a plurality of MEMS beam transducers having different proof masses corresponding to different resonant frequencies, and an application-specific integrated circuit (ASIC) electrically connected to the MEMS microphone and the MEMS beam transducers; a printed circuit board (PCB) positioned within the housing, wherein the multiple sensor package is mounted to the PCB; and a capacitive contact sensor mounted to the wall defining the vibration contact side for the remote controller. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a micro-electro-mechanical systems (MEMS) microphone and vibration sensor die, the method comprising:
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providing a substrate; and forming a MEMS microphone and a MEMS vibration sensor from the substrate, the MEMS microphone having a diaphragm and a top plate suspended over a first opening in the substrate, and the MEMS vibration sensor having a plurality of beam transducers with different resonant frequencies, each of the plurality of beam transducers having a beam and a proof mass suspended over a second opening in the substrate, and wherein the diaphragm and the beam of each of the plurality of beam transducers is formed from a polysilicon layer formed over the substrate. - View Dependent Claims (18, 19, 20)
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Specification