Embedded coins for HDI or SEQ laminations

• US 9,661,738 B1
• Filed: 09/03/2014
• Issued: 05/23/2017
• Est. Priority Date: 09/03/2014
• Status: Active Grant

• Current Assignee: Flex, Ltd.
• Original Assignee: Flextronics America LLC (Flextronics International Limited)
• Inventors: Jacobsson, Henrik, Yu, Pui Yin
• Primary Examiner(s): Willis, Tremesha S
• Application Number:
  US14/476,549
• Time in Patent Office: 993 Days
• Field of Search: 174252, 174250, 174251, 174255-258, 174260
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/2518 being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

A method of and a device for dissipating/transferring heat through one or more solid vias and embedded coins are disclosed. The method and device disclosed herein can be used to transfer heat for a High Density Interconnect (HDI) board.

Claims

1. A heat dissipating device comprising:

a. a coin embedded in a PCB board such that all surfaces of the coin are covered; and

b. a plurality of vias thermally coupling with and directly connected to the coin, wherein the PCB board is sandwiched by a heat source and a heat sink such that a first subset of vias is thermally coupled to the heat source and directly connected to a first side of the coin, and a second subset of vias is thermally coupled to the heat sink and directly connected to a second side of the coin opposite the first side, further wherein the coin is completely encapsulated by prepreg of the PCB board on all sides except where the first subset of vias contact the first side and where the second subset of vias contact the second side.

2. The device of claim 1, wherein the coin comprises a metal coin.

3. The device of claim 1, wherein the PCB board is thicker than the thickness of the coin.

4. A method of making a heat dissipating device comprising:

a. embedding a coin in an electronic board by forming a recess in the electronics board, placing the coin in the recess and performing lamination; and

b. forming a plurality of heat conducting channels, such that a first subset of heat conducting channels are thermally coupling and directly connecting a heat source and the coin, and a second subset of heat conducting channels are thermally coupling and directly connecting a heat sink and the coin, further wherein the coin is completely encapsulated by prepreg of the electronic board on all sides except where the first subset of heat conducting channels contact a first side and where the second subset of heat conducting channels contact a second side, wherein the one or more heat conducting channels comprises one or more vias.

5. The method of claim 4, further comprising core routing.

6. The method of claim 5, wherein the core routing forms a recess having a size larger than a size of the coin.

7. The method of claim 4, further comprising inserting the coin.

8. The method of claim 4, further comprising drilling one or more holes on the electronic board in an area with the coin.

9. The method of claim 8, further comprising plating the one or more holes to form the one or more heat conducting channels.

10. The method of claim 8, wherein the drilling is performed by using a CO₂ laser.

11. An electronic device comprising:

a. a metal piece embedded inside an electronic board such that all surfaces of the metal piece are covered;

b. a first set of multiple heat conducting paths thermally coupled with and directly connected to the metal piece on a first side; and

c. a second set of multiple heat conducting paths thermally coupled with and directly connected to the metal piece on an opposite side,

wherein the metal piece is completely encapsulated by prepreg of the electronic board on all sides except where the first subset of multiple heat conducting paths contact the first side and where the second subset of multiple heat conducting paths contact the opposite side.

12. The device of claim 11, wherein the first set of multiple heat conducting paths are thermally coupled with a heat source.

13. The device of claim 12, wherein the heat source comprises an electronic component.

14. The device of claim 13, wherein the electronic component comprises an IC chip.

15. The device of claim 11, wherein the second set of multiple heat conducting paths thermally couple with one or more heat sinks.