Electronic modules having grounded electromagnetic shields

• US 9,661,739 B2
• Filed: 01/13/2015
• Issued: 05/23/2017
• Est. Priority Date: 08/08/2005
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Inventors: Leahy, Donald Joseph, Parker, Stephen, Morris, Thomas Scott, Sawyer, Brian D.
• Primary Examiner(s): Ng, Sherman
• Application Number:
  US14/595,401
• Publication Number:
  US 20150124421A1
• Time in Patent Office: 861 Days
• Field of Search: 174350, 257659, 257660
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/0949 Pad close to a hole, not surrounding the hole if used for surface mounting H05K1/114
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49171 with encapsulating

Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Claims

1. An electronic module comprising:

a substrate comprising a component portion including a component area on a surface of the substrate and a plurality of metallic layers each extending along a periphery of the component portion below the surface of the substrate such that the plurality of metallic layers surround the component portion and are coupled to one another;

an electronic component on the component area;

an overmold formed over the component area; and

an electromagnetic shield formed over the overmold and covering the component area, the electromagnetic shield being coupled along the periphery of the component portion to at least a first metallic layer in the plurality of metallic layers.

2. The electronic module of claim 1, further comprising a plurality of conductive vias that couple the plurality of metallic layers.

3. The electronic module of claim 1, wherein the plurality of metallic layers further comprises:

wherein the first metallic layer is on the surface of the substrate and extends along a perimeter of the component area; and

a second metallic layer within the substrate that is positioned below the first metallic layer.

4. The electronic module of claim 3, further comprising:

wherein the first metallic layer substantially surrounds the perimeter of the component area, and the second metallic layer substantially surrounds the periphery of the component portion; and

a first plurality of conductive vias positioned between the first and second metallic layers and substantially surrounding the periphery of the component portion.

5. The electronic module of claim 4, further comprising:

the plurality of metallic layers further comprising a third metallic layer that extends along the periphery of the component portion and is below the first and second metallic layers; and

a second plurality of conductive vias positioned between the second and third metallic layers and substantially surrounding the periphery of the component portion.

6. The electronic module of claim 1, wherein the plurality of metallic layers further comprise:

wherein the first metallic layer is below the component area; and

a second metallic layer within the substrate that is positioned below the first metallic layer.

7. The electronic module of claim 6, further comprising:

wherein the first metallic layer substantially surrounds the periphery of the component portion;

wherein the second metallic layer substantially surrounds the periphery of the component portion; and

a first plurality of conductive vias positioned between the first and second metallic layer and substantially surrounding the periphery of the component portion.

8. The electronic module of claim 1, further comprising:

the plurality of metallic layers including a second metallic layer within the substrate wherein the second metallic layer is positioned below the first metallic layer and each of the first and second metallic layers have an extended section that extends from the periphery and into the component portion; and

at least one conductive vias that couples each of the extended sections of the first and second metallic layers.