Plasma vapor chamber and antimicrobial applications thereof

• US 9,662,412 B2
• Filed: 02/11/2016
• Issued: 05/30/2017
• Est. Priority Date: 02/11/2015
• Status: Active Grant

• Current Assignee: GOJO Industries Incorporated
• Original Assignee: EP Technology (Boston Scientific Corporation)
• Inventors: Ferrell, James, Bogovich, Erinn R., Gray, Robert L., Pappas Antonakas, Daphne, Tsai, Tsung-Chan, Kalghatgi, Sameer
• Primary Examiner(s): SOUW, BERNARD E
• Application Number:
  US15/041,102
• Publication Number:
  US 20160228592A1
• Time in Patent Office: 474 Days
• Field of Search: 250538, 250526, 422 1, 422 4, 422 5, 422 11, 422 24, 422 26, 422 22, 422 28, 422 29, 422 40, 422120, 422121, 422186, 42218604, 134 30, 134 56 R, 134 57 R, 134 953, 1341021, 1341022, 134200, 134201, 204164, 204526, 204527
• CPC Class Codes: A61L 2/14 Plasma, i.e. ionised gases
• CPC Class Codes: A61L 2202/122 Chambers for sterilisation
• CPC Class Codes: H05H 1/2406 using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes

Abstract

Exemplary apparatuses and methods of killing or deactivating bacteria are disclosed herein. An exemplary apparatus for killing or deactivating bacteria includes a plasma vapor chamber. The plasma vapor chamber has a vapor inlet for allowing a vapor into the chamber, a high voltage electrode, one or more grounding electrodes. The one or more grounding electrodes at least partially surrounding the plasma vapor chamber. The plasma vapor chamber includes an outlet for allowing fluid to flow out of the chamber. When the chamber is filled with vapor for a period of time sufficient to saturate the chamber with vapor, the high voltage electrode is energized to generate plasma throughout the chamber.

Claims

1. An apparatus for killing or deactivating bacteria comprising:

a chamber;

a vapor inlet for allowing a vapor into the chamber;

a high voltage electrode;

one or more grounding electrodes, at least partially surrounding the chamber;

an outlet for allowing fluid to flow out of the chamber;

wherein the chamber is filled with vapor for a period of time sufficient to saturate the chamber with vapor; and

the high voltage electrode is energized to generate plasma throughout the chamber.

2. The apparatus of claim 1 wherein the plasma is focused in one or more locations in the chamber.

3. The apparatus of claim 1 wherein the one or more grounding electrodes are placed in locations around the chamber, and wherein the placement of the one or more grounding electrodes cause the plasma to be focused in one or more locations in the chamber.

4. The apparatus of claim 1 wherein one or more of the grounding electrodes are formed with mesh.

5. The apparatus of claim 1 wherein the vapor replaces substantially all of the ambient air in the chamber.

6. The apparatus of claim 1 further comprising a bubbler in fluid communication with the vapor inlet.

7. The apparatus of claim 6 further comprising a source of nitrogen to flow through the bubbler.

8. The apparatus of claim 7 further comprising a source of oxygen to flow through the bubbler.

9. The apparatus of claim 8 wherein the flow rate of nitrogen and oxygen is between about 200 and 500 sccm.

10. The apparatus of claim 8 wherein the flow rate of nitrogen and oxygen is between about 300 and 400 sccm.

11. An apparatus for killing or deactivating bacteria comprising:

a chamber;

a vapor inlet for allowing a vapor into the chamber;

a high voltage electrode;

one or more grounding electrodes;

an outlet for allowing fluid to flow out of the chamber;

wherein the chamber is filled with vapor for a period of time sufficient to saturate the chamber with vapor; and

the high voltage electrode is energized to generate plasma in the vapor.

12. The apparatus of claim 11 further comprising a vapor.

13. The apparatus of claim 12 vapor comprises a mixture of nitrogen and oxygen.

14. The apparatus of claim 13 wherein the ratio of nitrogen to oxygen is greater than 1 to 1.

15. The apparatus of claim 13 wherein the ratio of nitrogen to oxygen is greater than 40 to 1.

16. The apparatus of claim 13 wherein the nitrogen comprises greater than about 98% of the one or more gases.

17. The apparatus of claim 12 wherein the vapor comprises a mixture of vaporized alcohol and water.

18. The apparatus of claim 17 wherein the alcohol is ethanol.

19. The apparatus of claim 18 wherein the vapor comprises less than 90% ethanol (v/v %) in water.

20. The apparatus of claim 18 wherein the vapor comprises between 40% and 90% ethanol (v/v %) in water.