High infrared reflection coatings, thin film coating deposition methods and associated technologies
First Claim
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1. A coated substrate comprising a substrate and a low-emissivity coating, the substrate having a major surface that bears the low-emissivity coating, the low-emissivity coating comprising a first infrared-reflection film region having a thickness, a second infrared-reflection film region having a thickness, and a third infrared-reflection film region having a thickness, the low-emissivity coating comprising, from said major surface outwardly:
- a) a first transparent dielectric film region;
b) the first infrared-reflection film region;
c) a first blocker film region deposited as an oxynitride directly on and contiguous to the first infrared-reflection film region;
d) a second transparent dielectric film region;
e) the second infrared-reflection film region;
f) a second blocker film region deposited as an oxynitride directly on and contiguous to the second infrared-reflection film region;
g) a third transparent dielectric film region;
h) the third infrared-reflection film region;
i) a third blocker film region deposited as an oxynitride directly on and contiguous to the first infrared-reflection film region; and
j) a fourth transparent dielectric film region,wherein the first, second, and third blocker film regions each have a thickness in the range of 3-25 angstroms.
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Abstract
The invention provides low-emissivity coatings that are highly reflective of infrared radiation. The coating includes three infrared-reflection film regions, which may each comprise silver.
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Citations
6 Claims
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1. A coated substrate comprising a substrate and a low-emissivity coating, the substrate having a major surface that bears the low-emissivity coating, the low-emissivity coating comprising a first infrared-reflection film region having a thickness, a second infrared-reflection film region having a thickness, and a third infrared-reflection film region having a thickness, the low-emissivity coating comprising, from said major surface outwardly:
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a) a first transparent dielectric film region; b) the first infrared-reflection film region; c) a first blocker film region deposited as an oxynitride directly on and contiguous to the first infrared-reflection film region; d) a second transparent dielectric film region; e) the second infrared-reflection film region; f) a second blocker film region deposited as an oxynitride directly on and contiguous to the second infrared-reflection film region; g) a third transparent dielectric film region; h) the third infrared-reflection film region; i) a third blocker film region deposited as an oxynitride directly on and contiguous to the first infrared-reflection film region; and j) a fourth transparent dielectric film region, wherein the first, second, and third blocker film regions each have a thickness in the range of 3-25 angstroms. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification