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Three-dimensional one-time-programmable memory comprising off-die address/data-translator

  • US 9,666,300 B2
  • Filed: 10/24/2016
  • Issued: 05/30/2017
  • Est. Priority Date: 09/01/2011
  • Status: Active Grant
First Claim
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1. A discrete three-dimensional one-time-programmable memory (3D-OTP), comprising:

  • a 3D-array die comprising at least a 3D-OTP array, wherein said 3D-OTP array comprises a plurality of vertically stacked 3D-OTP cells;

    a peripheral-circuit die comprising at least an off-die A/D-translator of said 3D-OTP array, wherein said off-die A/D-translator converts at least an address and/or data between logic and physical spaces;

    means for coupling said 3D-array die and said peripheral-circuit die;

    wherein the number of back-end-of-line (BEOL) levels in said 3D-array die is at least twice as much as the number of interconnect levels in said peripheral-circuit die;

    said off-die A/D-translator is absent from said 3D-array die; and

    , said 3D-array die and said peripheral-circuit die are separate dice.

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