Superposed structure 3D orthogonal through substrate inductor
First Claim
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1. A method for forming a three-dimensional inductor pair, comprising:
- providing a substrate, wherein the substrate has a substrate top surface and a substrate bottom surface;
forming in the substrate, in an alignment with a winding section of a first winding axis, a plurality of pairs of first coil via through holes, wherein each pair of first coil via through holes comprises two via through holes spaced symmetrically from the first winding axis by a first horizontal winding radius;
forming in the substrate, in an alignment with a winding section of a second winding axis, a plurality of pairs of second coil via through holes, wherein each pair of second coil via through holes comprises two via through holes spaced symmetrically from the first winding axis by a second horizontal winding radius, wherein the first winding axis is orthogonal to the second winding axis, wherein the first winding axis intersects the second winding axis at an intersection point, and wherein the intersection point is concurrently within the winding section of the first winding axis and the winding section of the second winding axis;
filling the plurality of pairs of first coil via through holes and the plurality of pairs of second via through holes with metal to form, respectively, a plurality of pairs of first coil vias, and a plurality of pairs of second coil vias;
forming a first top metallization, wherein the first top metallization is on the substrate top surface, wherein the first top metallization includes a first coil top offset cross trace, wherein the first coil top offset cross trace is arranged to pass over the first winding axis and to couple a top of a first via of a first pair of first coil vias to a top of a first via of a second pair of first coil vias;
forming a first bottom metallization, wherein the first bottom metallization is on the substrate bottom surface, wherein the first bottom metallization includes a second coil bottom cross trace, wherein the second coil bottom cross trace is arranged to pass under the second winding axis and to couple a bottom of a first via of a first pair of second coil vias to a bottom of the second via of the first pair of second coil vias;
forming a second top metallization, wherein the second top metallization is on the substrate top surface, wherein the second top metallization includes a second coil top offset cross trace, wherein the second coil top offset cross trace is arranged to pass over the second winding axis and over the first coil top offset cross trace and to couple a top of the second via of the first pair of second coil vias to a top of a first via of a second pair of second coil vias; and
forming a second bottom metallization, wherein the second bottom metallization is on the substrate bottom surface, wherein the second bottom metallization includes a first coil bottom cross trace, wherein the first coil bottom cross trace is arranged to pass under the first winding axis and to couple a bottom of a second via of the first pair of first coil vias to a bottom of the first via of the first pair of first coil vias.
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Abstract
A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.
16 Citations
7 Claims
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1. A method for forming a three-dimensional inductor pair, comprising:
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providing a substrate, wherein the substrate has a substrate top surface and a substrate bottom surface; forming in the substrate, in an alignment with a winding section of a first winding axis, a plurality of pairs of first coil via through holes, wherein each pair of first coil via through holes comprises two via through holes spaced symmetrically from the first winding axis by a first horizontal winding radius; forming in the substrate, in an alignment with a winding section of a second winding axis, a plurality of pairs of second coil via through holes, wherein each pair of second coil via through holes comprises two via through holes spaced symmetrically from the first winding axis by a second horizontal winding radius, wherein the first winding axis is orthogonal to the second winding axis, wherein the first winding axis intersects the second winding axis at an intersection point, and wherein the intersection point is concurrently within the winding section of the first winding axis and the winding section of the second winding axis; filling the plurality of pairs of first coil via through holes and the plurality of pairs of second via through holes with metal to form, respectively, a plurality of pairs of first coil vias, and a plurality of pairs of second coil vias; forming a first top metallization, wherein the first top metallization is on the substrate top surface, wherein the first top metallization includes a first coil top offset cross trace, wherein the first coil top offset cross trace is arranged to pass over the first winding axis and to couple a top of a first via of a first pair of first coil vias to a top of a first via of a second pair of first coil vias; forming a first bottom metallization, wherein the first bottom metallization is on the substrate bottom surface, wherein the first bottom metallization includes a second coil bottom cross trace, wherein the second coil bottom cross trace is arranged to pass under the second winding axis and to couple a bottom of a first via of a first pair of second coil vias to a bottom of the second via of the first pair of second coil vias; forming a second top metallization, wherein the second top metallization is on the substrate top surface, wherein the second top metallization includes a second coil top offset cross trace, wherein the second coil top offset cross trace is arranged to pass over the second winding axis and over the first coil top offset cross trace and to couple a top of the second via of the first pair of second coil vias to a top of a first via of a second pair of second coil vias; and forming a second bottom metallization, wherein the second bottom metallization is on the substrate bottom surface, wherein the second bottom metallization includes a first coil bottom cross trace, wherein the first coil bottom cross trace is arranged to pass under the first winding axis and to couple a bottom of a second via of the first pair of first coil vias to a bottom of the first via of the first pair of first coil vias. - View Dependent Claims (2, 3, 4, 5)
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6. A method for forming a three-dimensional inductor pair, comprising
providing a substrate, wherein the substrate has a substrate top surface and a substrate bottom surface; -
forming in the substrate, in an alignment with a winding section of a first winding axis, a plurality of pairs of first coil via through holes, wherein each pair of first coil via through holes comprises two via through holes spaced symmetrically from the first winding axis by a first horizontal winding radius; forming in the substrate, in an alignment with a winding section of a second winding axis, a plurality of pairs of second coil via through holes, wherein each pair of second coil via through holes comprises two via through holes spaced symmetrically from the second winding axis by a second horizontal winding radius, wherein the first winding axis is orthogonal to the second winding axis, wherein the first winding axis intersects the second winding axis at an intersection point, and wherein the intersection point is concurrently within the winding section of the first winding axis and the winding section of the second winding axis; filling the plurality of pairs of first coil via through holes and the plurality of pairs of second coil via through holes with metal to form, respectively, a plurality of pairs of first coil vias, and a plurality of pairs of second coil vias; forming a first top metallization, wherein the first top metallization is on the substrate top surface, wherein the first top metallization includes a first coil top offset cross trace, wherein the first coil top offset cross trace passes over the first winding axis and couples a top of a first via of a first pair of first coil vias to a top of a first via of a second pair of first coil vias; forming a first bottom metallization, wherein the first bottom metallization is on the substrate bottom surface, wherein the first bottom metallization includes a first coil bottom cross trace, wherein the first coil bottom cross trace passes under the first winding axis and couples a bottom of a second via of the first pair of first coil vias to a bottom of the first via of the first pair of first coil vias; forming a second top metallization, wherein the second top metallization is on the substrate top surface, wherein the second top metallization includes a second coil top offset cross trace, wherein the second coil top offset cross trace passes over the second winding axis and over the first coil top offset cross trace and couples a top of a first via of a first pair of second coil vias to a top of a first via of a second pair of second coil vias; and forming a second bottom metallization, wherein the second bottom metallization is on the substrate bottom surface, wherein the second bottom metallization includes a second coil bottom cross trace, wherein the second coil bottom cross trace passes under the second winding axis and couples a bottom of a second via of the first pair of second coil vias to a bottom of the first via of the first pair of second coil vias. - View Dependent Claims (7)
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Specification