Substrate for mounting a chip and chip package using the substrate
First Claim
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1. A chip-mounting substrate, comprising:
- a plurality of conductive portions configured to apply voltages to at least two or more chips to be mounted;
a plurality of insulation portions formed between the conductive portions and configured to electrically isolate the conductive portions;
a cavity formed in a region which includes at least three or more of the conductive portions and at least two or more of the insulation portions and depressed inward to form a space in which the chips are mounted; and
through-holes located on cutting lines of the chip-mounting substrate so as to penetrate and divide the insulation portions, wherein the cutting lines are lines along which the chip-mounting substrate is diced into unit chip-mounting substrates.
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Abstract
Disclosed is a chip-mounting substrate. The chip-mounting substrate includes a plurality of conductive portions configured to apply voltages to at least two or more chips to be mounted, a plurality of insulation portions formed between the conductive portions and configured to electrically isolate the conductive portions, and a cavity formed in a region which includes at least three or more of the conductive portions and at least two or more of the insulation portions and depressed inward to form a space in which the chips are mounted.
125 Citations
12 Claims
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1. A chip-mounting substrate, comprising:
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a plurality of conductive portions configured to apply voltages to at least two or more chips to be mounted; a plurality of insulation portions formed between the conductive portions and configured to electrically isolate the conductive portions; a cavity formed in a region which includes at least three or more of the conductive portions and at least two or more of the insulation portions and depressed inward to form a space in which the chips are mounted; and through-holes located on cutting lines of the chip-mounting substrate so as to penetrate and divide the insulation portions, wherein the cutting lines are lines along which the chip-mounting substrate is diced into unit chip-mounting substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An uncut chip-mounting plate, comprising:
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a plurality of conductive portions configured to apply voltages to at least two or more chips which are mounted on each of unit chip-mounting substrates defined on the uncut chip-mounting plate; a plurality of insulation portions formed between the conductive portions in each of the unit chip-mounting substrates and configured to electrically isolate the conductive portions; a cavity formed in a region of each of the unit chip-mounting substrates which includes at least three or more of the conductive portions and at least two or more of the insulation portions and depressed inward to form a space in which the chips are mounted; and through-holes located on cutting lines of the uncut chip-mounting plate so as to penetrate and divide the insulation portions, wherein the cutting lines are lines along which the uncut chip-mounting plate is diced into unit chip-mounting substrates.
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12. A chip package, comprising:
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at least two or more chips; a plurality of conductive portions configured to apply voltages to the chips; a plurality of insulation portions formed between the conductive portions and configured to electrically isolate the conductive portions; and a cavity formed in a region which includes at least three or more of the conductive portions and at least two or more of the insulation portions and depressed inward to form a space in which the chips are mounted, wherein the chips are mounted on the conductive portions and are applied with voltages of opposite polarities from the conductive portions; and through-holes are located on cutting lines of a chip-mounting plate so as to penetrate and divide the insulation portions, wherein the cutting lines are lines along which the chip-mounting plate is diced into unit chip-mounting substrates.
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Specification