Method of making low profile sensor package with cooling feature
First Claim
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1. A method of forming a sensor device, comprising:
- providing a silicon substrate with opposing first and second surfaces;
forming a sensor at or in the first surface;
forming a plurality of first contact pads at the first surface which are electrically coupled to the sensor;
forming a plurality of cooling channels as first trenches extending into the second surface but not reaching the first surface;
mounting a second substrate to the silicon substrate, wherein the second substrate includes;
opposing first and second surfaces;
a plurality of second contact pads disposed at the first surface of the second substrate;
a plurality of electrical leads extending through the second substrate and electrically coupled to the plurality of second contact pads;
wherein the mounting includes mounting the second surface of the silicon substrate to the first surface of the second substrate; and
connecting a plurality of wires each between one of the first contact pads and one of the second contact pads.
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Abstract
A sensor device and method of making same that includes a silicon substrate with opposing first and second surfaces, a sensor formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor, and a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface. The cooling channels instead can be formed on one or more separate substrates that are attached to the silicon substrate for cooling the silicon substrate.
78 Citations
8 Claims
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1. A method of forming a sensor device, comprising:
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providing a silicon substrate with opposing first and second surfaces; forming a sensor at or in the first surface; forming a plurality of first contact pads at the first surface which are electrically coupled to the sensor; forming a plurality of cooling channels as first trenches extending into the second surface but not reaching the first surface; mounting a second substrate to the silicon substrate, wherein the second substrate includes; opposing first and second surfaces; a plurality of second contact pads disposed at the first surface of the second substrate; a plurality of electrical leads extending through the second substrate and electrically coupled to the plurality of second contact pads; wherein the mounting includes mounting the second surface of the silicon substrate to the first surface of the second substrate; and connecting a plurality of wires each between one of the first contact pads and one of the second contact pads. - View Dependent Claims (2, 3)
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4. A method of forming a sensor device, comprising:
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providing a silicon substrate with opposing first and second surfaces; forming a sensor at or in the first surface; forming a plurality of first contact pads at the first surface which are electrically coupled to the sensor; providing a second substrate with opposing first and second surfaces; forming a plurality of cooling channels as first trenches extending into one of the first and second surfaces of the second substrate but not reaching the other of the first and second surfaces of the second substrate; and mounting the second surface of the silicon substrate to the first surface of the second substrate with thermally conductive material continuously disposed between the second surface of the silicon substrate and the first surface of the second substrate. - View Dependent Claims (5, 6, 7, 8)
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Specification