External storage device and method of manufacturing external storage device
First Claim
1. An external storage device comprising:
- an interconnect substrate comprising a first main surface, a first side, and an external terminal over the first main surface;
a first semiconductor chip comprising a storage device, an inductor connected to the storage device, and a driver circuit configured to control the inductor, the first semiconductor chip being disposed over the first main surface of the interconnect substrate; and
a sealing resin layer which seals the first semiconductor chip,wherein the first main surface of the interconnect substrate comprises a first region and a second region more remote from the first side than the first region,wherein the external terminal is over the first region of the first main surface, and the first semiconductor chip is over the second region of the first main surface,wherein the external terminal comprises a first surface facing in a same direction as the first main surface of the interconnect substrate,wherein the first surface of the external terminal comprises a first portion and a second portion more remote from the first side than the first portion,wherein the sealing resin layer covers the second portion of the first surface of the external terminal without covering the first portion of the first surface of the external terminal.
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Accused Products
Abstract
An external storage device including an interconnect substrate having a contact type external terminal, at least one semiconductor chip disposed over a first surface of the interconnect substrate, and a sealing resin layer which seals the at least one semiconductor chip and does not cover the external terminal. The at least one semiconductor chip includes a storage device, an inductor being connected to the storage device, a driver circuit configured to control the inductor and an interconnect layer. The interconnect layer is formed at a first surface of the semiconductor chip and includes the inductor. The first surface of the semiconductor chip is other than facing the first surface of the interconnect substrate, and the inductor and the driver circuit are connected to each other through the interconnect layer.
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Citations
19 Claims
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1. An external storage device comprising:
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an interconnect substrate comprising a first main surface, a first side, and an external terminal over the first main surface; a first semiconductor chip comprising a storage device, an inductor connected to the storage device, and a driver circuit configured to control the inductor, the first semiconductor chip being disposed over the first main surface of the interconnect substrate; and a sealing resin layer which seals the first semiconductor chip, wherein the first main surface of the interconnect substrate comprises a first region and a second region more remote from the first side than the first region, wherein the external terminal is over the first region of the first main surface, and the first semiconductor chip is over the second region of the first main surface, wherein the external terminal comprises a first surface facing in a same direction as the first main surface of the interconnect substrate, wherein the first surface of the external terminal comprises a first portion and a second portion more remote from the first side than the first portion, wherein the sealing resin layer covers the second portion of the first surface of the external terminal without covering the first portion of the first surface of the external terminal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An external storage device comprising:
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an interconnect substrate comprising a first main surface, a first side, and an external terminal over the first main surface; a first semiconductor chip comprising a storage element, the first semiconductor chip being disposed over the first main surface of the interconnect substrate; a second semiconductor chip comprising an inductor connected to the storage element, and a driver circuit configured to control the inductor, the second semiconductor chip being disposed over the first main surface of the interconnect substrate; and a sealing resin layer which seals said first and second semiconductor chips, wherein the first main surface of the interconnect substrate comprises a first region and a second region more remote from the first side than the first region, wherein the external terminal is over the first region of the first main surface, and the first semiconductor chip and the second semiconductor chip are over the second region of the first main surface, wherein the external terminal comprises a first surface facing in a same direction as the first main surface of the interconnect substrate, wherein the first surface of the external terminal comprises a first portion and a second portion more remote from the first side than the first portion, wherein the sealing resin layer covers the second portion of the first surface of the external terminal without covering the first portion of the first surface of the external terminal. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification