Multi-chip light emitter packages and related methods

• US 9,666,762 B2
• Filed: 03/12/2013
• Issued: 05/30/2017
• Est. Priority Date: 10/31/2007
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Lowes, Theodore, Keller, Bernd P.
• Primary Examiner(s): ZARNEKE, DAVID A
• Application Number:
  US13/796,954
• Publication Number:
  US 20130270581A1
• Time in Patent Office: 1,540 Days
• Field of Search: 257 98
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 : Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 : Heat extraction or cooling elements
• CPC Class Codes: H01L 33/647 : the elements conducting electric current to or from the semiconductor body

Abstract

Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one aspect, a light emitter package can include a submount, an array of light emitter chips disposed on a portion of the submount, and a lens provided over the submount and covering at least portions of the array. In some aspects, at least some of the light emitter chips can be adapted to emit light of a first dominant wavelength. In further aspects, at least some other light emitter chips are adapted to emit light of a second dominant wavelength that is different than the first dominant wavelength. In some aspects, the lens can be asymmetric. In some aspects, a collective center of the chips, or a center of an array of chips can be offset from a center of the asymmetric lens.

Claims

1. A light emitter package comprising:

a submount;

an array of light emitter chips disposed on a portion of the submount, wherein at least some of the light emitter chips are adapted to emit light of a first dominant wavelength and wherein at least some others of the light emitter chips are adapted to emit light of a second dominant wavelength different than the first dominant wavelength; and

a lens disposed over the submount and covering a plurality of the light emitter chips, wherein the lens is asymmetric, wherein the lens is in contact with the array of light emitter chips, and wherein the lens comprises an apex disposed over the submount, the apex being substantially centered over the submount in a first direction and non-centered over the submount in a second direction orthogonal to the first direction.

2. The package of claim 1, wherein the first dominant wavelength is between approximately 430 nm and approximately 480 nm.

3. The package of claim 1, wherein the second dominant wavelength is between approximately 600 nm to approximately 630 nm.

4. The package of claim 1, wherein at least some of the light emitter chips are at least partially coated with a phosphor adapted to emit light of a third dominant wavelength between approximately 555 nm to approximately 585 nm.

5. The package of claim 1, wherein the package is configured to refract light emitted by the array of light emitter chips toward a preferential direction.

6. The package of claim 1, wherein the array of light emitter chips comprises an LED populated area of approximately 18 mm² or more.

7. The package of claim 1, wherein the array of light emitter chips comprises an LED populated area of approximately 26 mm² or more.

8. The package of claim 6, wherein a centerline of the lens in the first direction is offset from a centerline of the LED populated area.

9. The package of claim 8, wherein the centerline of the lens in the first direction is offset from the centerline of the LED populated area in the first direction by approximately 0.24 mm or more.

10. The package of claim 6, wherein the array of light emitter chips within the LED populated area comprise an asymmetric or non-repetitive pattern.

11. The package of claim 6, wherein the array of light emitter chips within the LED populated area comprise a repetitive pattern.

12. The package of claim 1, wherein the submount comprises an area of approximately 88 mm² or more.

13. The package of claim 1, wherein the submount comprises a primary lens efficacy zone area of approximately 10 mm² or more.

14. The package of claim 1, wherein the package has an efficacy of at least approximately 100 lumens per watt (LPW) or more at an input power of 10 watts (W).

15. The package of claim 14, wherein the package has a color temperature of approximately 4000 K and an input power of approximately 10 W.

16. The package of claim 1, wherein a scotopic/photopic (S/P) ratio is greater than 2.

17. The package of claim 1, wherein a scotopic/photopic (S/P) ratio is less than 2.

18. The package of claim 6, wherein the LED populated area comprises 54 blue shifted yellow (BSY) light emitting diode (LED) chips and 30 red-orange (RDO) LED chips.

19. The package of claim 6, wherein the LED populated area comprises 54 blue shifted yellow (BSY) light emitting diode (LED) chips and 16 red-orange (RDO) LED chips.

20. The package of claim 6, wherein the LED populated area comprises 48 blue shifted yellow (BSY) light emitting diode (LED) chips and 30 red-orange (RDO) LED chips.

21. The package of claim 6, wherein the LED populated area comprises 48 blue shifted yellow (BSY) light emitting diode (LED) chips and 48 red-orange (RDO) LED chips.

22. The package of claim 6, wherein the LED populated area comprises 16 blue shifted yellow (BSY) light emitting diode (LED) chips and 16 red-orange (RDO) LED chips.

23. The package of claim 6, wherein the LED populated area comprises 23 blue shifted yellow (BSY) light emitting diode (LED) chips and 22 red-orange (RDO) LED chips.