Three dimensional system-on-chip image sensor package

• US 9,667,900 B2
• Filed: 11/26/2014
• Issued: 05/30/2017
• Est. Priority Date: 12/09/2013
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): Tissire, Abdelaaziz
• Application Number:
  US14/554,601
• Publication Number:
  US 20150163425A1
• Time in Patent Office: 916 Days
• CPC Class Codes: G02B 13/0015 characterised by the lens design
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 25/75 Circuitry for providing, modifying or processing image signals from the pixel array
• CPC Class Codes: H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors
• CPC Class Codes: H04N 25/77 Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
• CPC Class Codes: H04N 25/772 comprising A/D, V/T, V/F, I/T or I/F converters

Abstract

An image sensor that comprises a first substrate and a plurality of photo detector assemblies disposed on or in the first substrate. Each of the photo detector assemblies comprises a photo detector formed on or in a second substrate and configured to generate an analog signal in response to received light, a converter formed on or in a third substrate, wherein the converter is electrically coupled to the photo detector and includes circuitry for converting the analog signal to a digital signal, a processor formed on or in a fourth substrate, wherein the processor is electrically coupled to the converter and includes circuitry for processing the digital signal.

Claims

1. A method forming an image sensor, comprising:

providing a first substrate;

forming each of a plurality of photo detector assemblies disposed on or in the first substrate by;

forming a photo detector on or in a second substrate, wherein the photo detector is configured to generate an analog signal in response to received light,

forming a converter on or in a third substrate,

forming a processor on or in a fourth substrate,

electrically coupling the converter to the photo detector, wherein the converter includes circuitry for converting the analog signal to a digital signal, and

electrically coupling the processor to the converter, wherein the processor includes circuitry for processing the digital signal,

wherein the forming the converter and the electrically coupling of the processor to the converter includes;

forming a first routing layer on the fourth substrate, wherein the first routing layer includes a fifth substrate with at least one conductive trace;

bonding the third substrate onto the first routing layer,

thinning the third substrate, and

forming the circuitry for converting the analog signal to the digital signal in the third substrate after the bonding of the third substrate onto the first routing layer and the thinning of the third substrate.

2. The method of claim 1, wherein for each of the plurality of photo detector assemblies, the coupling of the converter to the photo detector includes forming a second routing layer between the second and third substrates, wherein the second routing layer comprises:

a sixth substrate disposed between the second and third substrates, and

at least one conductive trace in the sixth substrate configured to convey the analog signal from the photo detector to the converter.

3. The method of claim 1, further comprising:

forming an anti-reflective coating, a color filter and a lens over each of the photo detectors of the plurality of photo detector assemblies.

4. The method of claim 1, wherein the fourth substrates of all the plurality of photo detector assemblies are integrally formed as a single common substrate, and the second substrates of all the plurality of photo detector assemblies are separate substrates.

5. The method of claim 1, further comprising:

forming bond pads on the first substrate that are electrically connected to the plurality of photo detector assemblies;

mounting a circuit board to the first substrate, wherein the circuit board comprises;

electrical traces, and

bond pads electrically coupled to the electrical traces;

electrically coupling each of the bond pads of the first substrate with one of the bond pads of the circuit board with wire bonds.

6. The method of claim 1, further comprising:

forming bond pads on the first substrate that are electrically connected to the plurality of photo detector assemblies;

mounting a circuit board to the first substrate, wherein the circuit board comprises;

electrical traces, and

bond pads electrically coupled to the electrical traces;

electrically coupling each of the bond pads of the first substrate with one of the bond pads of the circuit board with electrical interconnects.

7. The method of claim 6, wherein the circuit board includes an aperture and wherein the photo detector assemblies are positioned to receive light passing through the aperture.