Electronic device having a cover in which a penetration hole is provided and manufacturing method of electronic device

• US 9,671,423 B2
• Filed: 09/04/2014
• Issued: 06/06/2017
• Est. Priority Date: 09/05/2013
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Takagi, Shigekazu
• Primary Examiner(s): GRAY, FRANCIS C
• Application Number:
  US14/477,104
• Publication Number:
  US 20150059475A1
• Time in Patent Office: 1,006 Days
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/088 for providing wafer-level encapsulation
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

An electronic device includes a substrate, a lid which is bonded to the substrate, and a functional element which is provided between the substrate and the lid, in which the lid includes a penetration hole which penetrates a portion between an inner surface and an outer surface, the penetration hole includes a first hole portion and a second hole portion, a flat area of the second hole portion is set to be smaller than a flat area of the first hole portion, at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion, and the penetration hole is sealed with a sealing member.

Claims

1. An electronic device comprising:

a substrate;

a cover which has an outer cover surface and an inner cover surface, the cover being bonded to the substrate so as to form an inner space between the substrate and the cover; and

a functional element which is provided in the inner space,

wherein the cover includes a penetration hole which penetrates the cover from the outer cover surface to the inner cover surface,

the penetration hole includes a first hole portion which is provided on an outer cover side of the cover directly adjacent to the outer cover surface, and the penetration hole includes a second hole portion which communicates with the first hole portion and which is provided on an inner cover side of the cover directly adjacent to the inner cover surface,

an opening of the second hole portion on the inner cover side is smaller than an opening of the first hole portion on the outer cover side,

at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion,

wherein the penetration hole is sealed with a sealing member, and

wherein glass is used as a main material of the substrate and silicon is used as a main material of the cover.

2. The electronic device according to claim 1,

wherein the opening of the second hole portion on the inner cover side is in a circular shape.

3. The electronic device according to claim 1,

wherein an inner wall surface of the first hole portion is inclined so that the opening of the first hole portion on the outer cover side is greater than an opening of the first hole portion located directly adjacent to the bottom surface of the first hole portion, and

the inner wall surface and the bottom surface of the first hole portion is covered with a metal film.

4. The electronic device according to claim 1,

wherein the cover is configured with a top cover which has the outer and inner cover surfaces and a side cover which is continuously formed with the top cover, and a side cover bottom surface of the side cover is bonded to the substrate, and

an inner wall surface of the side cover of the cover substantially forms a right angle with respect to the side cover bottom surface.

7. An electronic apparatus comprising the electronic device according to claim 1.

8. A moving object comprising the electronic device according to claim 1.

5. A manufacturing method of an electronic device, the electronic device including:

a substrate;

a cover which has an outer cover surface and an inner cover surface, the cover being bonded to the substrate so as to form an inner space between the substrate and the cover; and

a functional element which is provided in the inner space,

wherein the cover includes a penetration hole which penetrates the cover from the outer cover surface to the inner cover surface,

the penetration hole includes a first hole portion which is provided on an outer cover side of the cover directly adjacent to the outer cover surface, and the penetration hole includes a second hole portion which communicates with the first hole portion and which is provided on an inner cover side of the cover directly adjacent to the inner cover surface,

an opening of the second hole portion on the inner cover side is smaller than an opening of the first hole portion on the outer cover side,

at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion, and

wherein the penetration hole is sealed with a sealing member, the method comprising;

forming the first hole portion by wet etching; and

forming the second hole portion by dry etching,

wherein a hole diameter of the second hole portion on the inner cover surface is greater than that of the first hole portion located directly adjacent to the bottom surface of the first hole portion.

6. The manufacturing method of an electronic device according to claim 5,

wherein the cover is configured with a top cover which has the outer and inner cover surfaces and a side cover which is continuously formed with the top cover,

the method further comprising:

forming the side cover by dry etching.

9. An electronic device comprising:

a substrate;

a cover which has an outer cover surface and an inner cover surface, the cover being bonded to the substrate so as to form an inner space between the substrate and the cover; and

a functional element which is provided in the inner space,

wherein the cover includes a penetration hole which penetrates the cover from the outer cover surface to the inner cover surface,

the penetration hole includes a first hole portion which is provided on an outer cover side of the cover directly adjacent to the outer cover surface, and the penetration hole includes a second hole portion which communicates with the first hole portion and which is provided on an inner cover side of the cover directly adjacent to the inner cover surface,

an opening of the second hole portion on the inner cover side is smaller than an opening of the first hole portion on the outer cover side,

at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion,

wherein the penetration hole is sealed with a sealing member, and

wherein a hole diameter of the second hole portion on the inner cover surface is greater than that of the first hole portion located directly adjacent to the bottom surface of the first hole portion.